Hitachi, Ltd.

Fumikazu Ito

Takanori Ninomiya

Mikio Hongo

Masaaki Okunaka

Kazushi Yoshimura

Shigenobu Maruyama

Satoru Todoroki

Hideo Matsuzaki

A method and apparatus for inspecting wirings of an electronic circuit substrate to detect a defect in the wiring and for enabling correction thereof. The inspection method and apparatus include electrostatically coupling at least one electrode to a wiring pattern, applying a time varying voltage between the electrode and wiring pattern at different locations so as to detect a current flow and determine a defect by a variation in the detected current flow at the different locations and a portion of the defect. A defect in the form of a disconnected or half-disconnected point of the wiring may be corrected by supplying a solution of a metal complex to the disconnected or half-disconnected point, heating the solution and end point areas of the disconnected or half-disconnected point by laser light and precipitating a metal thin film establishing a connection of the wiring.

Method and apparatus for inspection and correction of wiring of

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Fujisawa, Japan

Fumikazu Ito