Hitachi-lg Data Storage, Inc.

Hitachi Media Electronics Co., Ltd.

Fumihito Ichikawa

Hiroshi Ogasawara

Hiroaki Furuichi

Manabu Ochi

Hiroyasu Yoshida

Seiichi Katou

Masashi Yamashita

Kazuhiko Ito

Yoshio Oozeki

Tatsuya Yamasaki

Mitsuo Satake

Kenji Watabe

Rika Nomura

Yukio Sakigawa

Masayuki Okamura

Kazuhiro Aoyama

Yoshitaka Kusano

Yukinari Ueki

There is provided a light source module in which an optical element is accommodated in a housing, in which three projection portions are provided in the housing, and the light source module has a structure where the optical element is pressed to be brought into contact with the three projection portions by a pressing member, so that the optical element is fixed in the housing.

Light source module

An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided. An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.

Sealing of optical module with O-ring and liquid resin

An optical module has light source mounting parts that include a reinforcement plate for a circuit board on which a light source is mounted, and is attached to a lateral surface of a housing. The optical module includes a protrusion and a thermally conductive member. The protrusion is formed on the outer circumference of the lateral surface of the housing. The thermally conductive member includes a first surface and a second surface. The first surface is thermally conductively connected to a surface of the reinforcement plate. The second surface is thermally conductively connected to the protrusion. The thermally conductive member has an inclined surface on the back side of the first surface. The inclined surface is formed along the first surface in such a manner that the thickness between the first surface and the inclined surface increases with a decrease in the distance to the second surface.

Optical module and projection image display device

Provided is a reliable optical pick-up which can prevent deterioration of a performance of a component, shortening of a service life or malfunctioning due to heat generation of an laser driver IC, wherein a metallic pattern is provided on a flexible printed board, having an area wider than the external shape of the laser driver IC and having an exposed outer surface, and made of the same material as that of a wiring pattern. It is preferable to bend the flexible printed board in a mounting part for the laser driver IC so that the metallic pattern is faced to and superposed with a surface of the flexible printed board on the side remote from the surface on which the laser driver IC is mounted.

Cooling arrangement for an optical pick-up

A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover film formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover film, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover film. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.

Connection structure of flexible printed circuits and optical pickup device including the connection structure

The present invention provides an optical head for realizing the stable operation by controlling the temperature of the semiconductor laser to a low level by reducing the heat transfer rate from a laser driver IC to a housing in the vicinity of a semiconductor laser, and an optical disc drive using the same. It provides an optical head having a semiconductor laser and a photo detector arranged on one side with respect to a straight line through the center of an object lens of an object lens actuator and in parallel to the axis contacted with bearings, and a laser driver IC arranged on the other side with respect to the straight line. Thereby, the distance from the laser driver IC to the semiconductor laser can sufficiently be ensured so that the heat transfer rate from the laser driver IC to the housing can be reduced.

Optical head and optical disc drive

Growing community of inventors

Tokyo, Japan

Fumihito Ichikawa