Jsr Corporation

Fumihisa Miyajima

Tomoki Nagai

Tsutomu Shimokawa

Daisuke Shimizu

Eiji Yoneda

Masaaki Miyaji

Kenichi Yokoyama

A positive tone radiation-sensitive resin composition comprising (A) a 1-substituted imidazole, (B) a photoacid generator, and (C-a) a resin protected by an acid-dissociable group, insoluble or scarcely soluble in alkali, but becoming soluble in alkali when the acid-dissociable group dissociates or (C-b) an alkali-soluble resin and an alkali solubility controller, and a negative tone radiation-sensitive resin composition comprising (A), (B), (D) an alkali-soluble resin, and (E) a compound that can crosslink the alkali-soluble resin in the presence of an acid. The radiation-sensitive resin composition of the present invention is a chemically amplified resist exhibiting high resolution and high storage stability as a composition, and suitable for microfabrication sensible to active radiations, for example, ultraviolet rays such as g-lines and i-lines, deep ultraviolet rays represented by a KrF excimer laser, ArF excimer laser, Fexcimer laser, and EUV excimer laser, and electron beams.

Radiation-sensitive resin composition

1. A copolymer having recurring units of the following formulas (1), (2), and (3), wherein R, R, R, and Rare a hydrogen atom or a methyl group, R, R, and Rrepresent a monovalent organic group, k is 1 or 2, 1 is 0&#x2013;4, n is 1&#x2013;3, m is 0&#x2013;3, Ris a substituted methyl group, 1-substituted ethyl group, 1-branched alkyl group, triorganosilyl group, triorganogermyl group, alkoxycarbonyl group, acyl group, or cyclic acid-dissociable group, with two or more Rgroups being the same or different, q is 1&#x2013;3, and p is 0&#x2013;3, the copolymer having a GPC average molecular weight of 3,000&#x2013;100,000. The composition is useful as a polymer component for a radiation-sensitive resin composition suitable as a chemically-amplified resist.

Copolymer, polymer mixture, and radiation-sensitive resin composition

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Tokyo, Japan

Fumihisa Miyajima