Mitsubishi Electric Corporation

Denka Company Limited

Fumihiro Nakahara

Kouji Nishimura

Ryota Aono

Yuta Tsugawa

Shingo Yamamoto

Seiji Yano

Ryohta Aono

A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 &#x3bc;m to 1.5 &#x3bc;m; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 &#x3bc;m to 1.5 &#x3bc;m.

Ceramic circuit substrate

A repeater includes a reception unit, a permission signal generating unit that detects the state of the pulses of the signal, and generates a permission signal that permits a relay of the signal when the permission signal generating unit detects the pulses, and that inhibits the relay of the signal when the permission signal generating unit detects an end of the pulses, and a transmission unit. When detecting the end of the pulses, for the permission signal, the permission signal generating unit sets a pulse re-input monitoring period for determining whether or not the pulses of the signal are re-detected. When detecting the pulses of the signal during the pulse re-input monitoring period, the permission signal generating unit determines that the signal continues, and when not detecting the pulses of the signal, the permission signal generating units determines that the signal ends.

Repeater and relay method for the same

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Tokyo, Japan

Fumihiro Nakahara