Nippon Mektron Limited

Organo Corporation

Japan Organo Co., Ltd.

Nippo Mektron, Ltd.

Fumihiko Matsuda

Shoji Takano

Takayuki Masuda

Kikuzo Kaneko

Yoshihiko Narisawa

Kohei Sato

Kouji Tanikawa

Tohru Sonobe

Sigeo Sakai

Hiroshi Ikeda

Hiroshi Shimizu

Hiroshi Takeuchi

Toru Mizuno

Akihiko Toyoshima

Kenji Kumagai

Toshinobu Miyagoshi

Garo Miyamoto

Kuniaki Kawano

Akimitsu Miyahara

Daisuke Shiokawa

Tatsunori Otomo

Hiroji Ushikubo

Yuki Ogi

Makoto Tomizawa

Masami Uchino

Masaharu Horie

Isao Arase

Reiko Matsumoto

A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

Wiring body and method for manufacturing same

Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Printed circuit board and method for manufacturing same

Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Probe device, electrical inspection apparatus, and electrical inspection method

The invention provides a method of manufacturing a printed circuit board. The printed circuit board () has a conductor layer (ground layer ()), a signal layer () having a signal line () provided so as to oppose the conductor layer (ground layer ()), and an insulating resin layer () disposed between the conductor layer (ground layer ()) and the signal layer (), the insulating resin layer () has voids in an overlapping location, in a plan view, with the signal line (), and the voids () are communicated with the outside of the printed circuit board ().

Method of manufacturing printed circuit board

A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.

Method for manufacturing multilayer printed circuit board

A printed wiring boardfor high frequency transmission according to an embodiment of the present invention includes: an insulating base material; a signal lineextending in a longitudinal direction of the insulating base material; ground wiringsextending in the longitudinal direction while being spaced apart from the signal lineby a predetermined distance; a ground layerformed on a major surface; a plurality of ground connection viaselectrically connecting the ground wiringand the ground layer; and a plurality of ground connection viaselectrically connecting the ground wiringand the ground layer. A width of the ground wiringsis smaller than a land diameter of the ground connection vias. Then, the ground connection viasand the ground connection viasare arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion

Printed wiring board for high frequency transmission

[Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield. [Solution] A method of manufacturing a flexible printed circuit board that includes a component mounting section () having lands (), a plurality of flexible cable sections () having wirings and extending in different directions from the component mounting section (), and a connection section () having terminals () connected with the land () through the wiring, the method including manufacturing partial FPCs in a sheet in a unit of a partial FPC that includes a partial component mounting section (A) that is a part of the component mounting section, a cable section () extending from the partial component mounting section (A), and a connection section () disposed in the cable section (), cutting out the partial FPC (A) from the sheet, performing an alignment using alignment targets () of the partial FPC (A) and a support plate () so that the partial component mounting sections (A) of respective partial FPCs (A) configure the component mounting section (), and fixing the partial FPCs (A) onto the support plate.

Method of manufacturing flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

Filling method of conductive paste and manufacturing method of multi-layer printed circuit board

A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.

Apparatus and method for mounting photoelectric element

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminateincluding an insulating substrateand metal foiland metal foilprovided on main surfaces of the substrate, a step of forming a circuit patternby patterning the metal foil, a step of forming a peelable printing plate layeron the substrateso as to embed the pattern, a step of forming blind holesandwhere the patternis exposed inside by partially removing the printing plate layer, a step of printing conductive paste with the printing plate layeras a printing mask, and filling the conductive pasteinside the blind holes, and a step of peeling off the printing plate layerfrom the metal foil clad laminate

Manufacturing method of flexible printed wiring board

Provided is a flexible printed wiring board capable of increasing the number of wires even when the board is used in a narrow arrangement space and enhancing the degree of freedom for design while maintaining the board in a self-supported state. A flexible printed wiring boardis used in a state, in which one and another ends in a longitudinal direction are fixed respectively to one and another members that move in relation to each other in a state of being bent to be curved in the longitudinal direction. The flexible printed wiring board includes wiring board unitsA andB in which a plurality of wires are formed on a flexible insulating substrate and which are molded in a state of being curved in a lateral direction, and adjacent wiring board units are partially connected at side edges thereof in the lateral direction.

Flexible printed wiring board

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

Manufacturing method of multilayer printed wiring board

A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL, and the solid ground layers are arranged on an inner peripheral side of the curved portions.

Flexible printed circuit board and manufacturing method of flexible printed circuit board

A method of manufacturing a flexible printed circuit board that includes a component mounting section having lands, a plurality of flexible cable sections having wirings and extending in different directions from the component mounting section, and a connection section having terminals connected with the land through the wiring, the method including manufacturing partial FPCs in a sheet in a unit of a partial FPC that includes a partial component mounting section that is a part of the component mounting section, a cable section extending from the partial component mounting section, and a connection section disposed in the cable section, cutting out the partial FPC from the sheet, performing an alignment using alignment targets of the partial FPC and a support plate so that the partial component mounting sections (A) of respective partial FPCs configure the component mounting section, and fixing the partial FPCs onto the support plate.

Flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

Growing community of inventors

Tokyo, Japan

Fumihiko Matsuda