Nissan Motor Company Limited

Tohoku University

National University Corporation Kitami Institute of Technology

Fumihiko Gejima

Hiroki Sakamoto

Hiroshi Sakurai

Masayuki Inoue

Kenji Kanamori

Masaki Kuno

Mamoru Sayashi

Takuro Yamaguchi

Tetsuji Morita

Hiroaki Matsumoto

Sadao Watanabe

Sadao Yanagida

Shuji Hanada

Provided is material for an aluminum alloy exhibiting a sufficient heat resistance, tensile strength as well as stress corrosion cracking resistance necessary for use as automobile parts. Also, provided are a forged part forged from such aluminum alloy and an aluminum alloy high strength bolt made thereof. The aluminum alloy (by mass) is consisted of (by mass) 1.0 to 1.7% of Si, 0.05 to 0.5% of Fe, 0.8 to 1.5% of Cu, 0.6 to 1.2% of Mn, 0.9 to 1.5% of Mg, 0.05 to 0.5% of Zn, 0.05 to 0.3% of Zr, 0.01 to 0.2% of V, and when needed, Ti exceeding 0% and not more than 0.05%, and, when further needed, Ni exceeding 0% and not more than 0.7%, the remainder being Al and unavoidable impurities.

Aluminum alloy and high strength bolt made of aluminum alloy

Inventors of the present invention have found that, by manufacturing a stress-buffering material with a Ca-containing aluminum alloy including 0.1 to 12 at % of Ca, the stress-buffering material at low cost, capable of expanding its use in various fields, and having low Young's modulus that is beyond a conventional level, can be obtain.

Stress-buffering material

Embodiments of the invention provide a semiconductor device having high reliability as they ease the thermal stress or a heat distortion or strain occurring during the manufacturing process or during operation, and the embodiments function with stability for a long time. A semiconductor device has a semiconductor substrate, an insulating ceramic plate on which the semiconductor substrate is mounted and stress bufferthat eases a thermal stress. The stress buffer is provided between the semiconductor substrate and the insulating ceramic plate and can be provided on a surface of the insulating ceramic plate that is opposite to a surface on which the semiconductor substrate is mounted. The stress buffer is formed from a structure including at least Al and a second phase. The second phase is AlX where X is at least one element of alkaline earth metal elements.

Semiconductor device

A reinforced member which is made from a steel product having a strain aging characteristic and has a closed section at a cross section perpendicular to an axis of the reinforced member. The reinforced member includes a reinforced area which is produced by press-forming the steel product so as to generate a compression strain in the press-formed steel product due to the application of a compression stress to the steel product along the direction from a surface of the steel product to an inside of the steel product, and by giving a strain aging treatment to the press-formed member.

Reinforced member

A titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a martensite phase. Alternatively, the titanium alloy contains vanadium, from 10 to 20% by weight; aluminum, from 0.2 to 10% by weight; and a balance essentially titanium, and the alloy has a microstructure including a &#x3b2; phase capable of transforming into a martensite phase by cold working or cooling under a room temperature.

Titanium alloy of low Young's modulus

A tubing including an overlap portion formed by the first and second circumferential end portions overlapping and joined with each other, and a fluid leakage preventing member for preventing pressurized fluid from leaking from the tubing upon the tubing being subjected to hydrostatic forming. An apparatus and method for hydrostatic forming of a tubing having an overlap portion. The apparatus includes a die and a nozzle having fluid leakage preventing means for preventing the pressurized fluid supplied into the tubing from leaking from a clearance between the first and second circumferential end portions of the overlap portion of the tubing at the longitudinal end portions of the tubing.

Growing community of inventors

Yokohama, Japan

Fumihiko Gejima