Kabushiki Kaisha Toshiba

Fumihide Nagashima

Takao Abe

Kentaro Tomioka

Takahiro Kojima

Tomonao Takamatsu

Kenichi Ito

Masaki Adachi

Katsuya Seko

Masaharu Yamanaka

Tatsuhiko Nagafuchi

Masayoshi Harada

Hirofumi Hansei

Hironari Kotsubo

A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.

Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

A fluid pump includes a case including a pump chamber, a reserve tank for storing spare liquid and located in the case but outside the pump chamber and formed so that a space independent of the pump chamber is defined by the reserve tank, a fluid path forming member arranged inside the reserve tank and including a discharge path communicating between a discharge port and the pump chamber, and a communication hole which is formed in a side of the fluid path forming member so as to assume such a position that the communication hole faces an inside of the reserve tank so that the hole communicates between the discharge path and the inside of the reserve tank, the communication hole being sized so that air in the pump chamber is allowed to flow through the hole into the reserve tank.

Fluid pump, cooling system and electrical appliance

Growing community of inventors

Yokohama, Japan

Fumihide Nagashima