Opnext Japan, Inc.

Oclaro Japan, Inc.

Fumihide Maeda

Hiroyoshi Ishii

Shigeru Tokita

Hiroo Matsue

Toshikazu Ohtake

Osamu Kagaya

Hideki Sato

Koji Takeguchi

Osamu Yamada

Hiroki Irie

Tadashi Hatano

Taichi Kogure

Koichi Omori

Satoshi Motohiro

Yoichi Honzawa

Akira Kuwahara

Hiroyoshi Isii

Katsumi Saito

The optical module includes a housing having a first opening for inputting or outputting a first electric signal, a second opening for inputting or outputting a second electric signal, and an optical signal port, one or more substrates disposed in the housing, to/from which the first electric signal is input/output and to/from which the second electric signal is input/output, an optical subassembly disposed in the housing and optically connected to the optical signal port, and a control circuit disposed in the housing and mounted on the substrate for controlling the optical subassembly, wherein the first electric signal is an electric signal input to or output from the optical subassembly, the second electric signal is an electric signal input to or output from the control circuit, and the second opening is provided on one side different from other side of the housing on which the first opening is provided.

Optical module and transmission device

An optical transceiver is configured to use, as an electric signal, a digital modulation signal having a predetermined bit rate. The optical transceiver includes a case having a space for storing a component therein and a resistor being arranged between upper and lower surfaces of the space and having conductance of from 1 S/m to 1,000 S/m. The space has a height equal to or less than a wavelength in a free space of an electromagnetic wave of a frequency corresponding to the predetermined bit rate. At least a part of the height of the space is larger than a half of the wavelength. The height of the space is smaller than a width of the space. The width of the space is smaller than a depth of the space.

Optical transceiver

An optical module includes an electromagnetic wave absorption member. The electric connection member includes a floating portion which is in a floating state spaced apart from the housing and at a position away from a mounting portion by which the electric connection member is mounted on the housing in the direction opposite to the direction that the optical module is inserted into a cage. At least a portion of the electromagnetic wave absorption member is arranged between the housing and the floating portion. The floating portion is brought into contact with an inner side of the cage so as to establish the electrical connection with the inner side of the cage when the housing is inserted into the cage.

Optical module and cage

An optical transceiver has a projection covering member that can suppress EMI noise radiated from a pig-tail part. An elastic covering member covers a projection which includes an optical coupler of an optical sub assembly. The covering member is made of a conductive elastic material having a predetermined resistivity. At least a part of an outer circumference surface of the elastic covering member comes into intimate contact with an outer periphery of a conductive opening part of a case for the optical transceiver while an inner circumference surface of the elastic covering member comes into intimate contact with the projection.

Optical transceiver and projection covering member

In an optical transmission module having a communication module which is freely movable in a case, when a tensile force is generated on an optical cable after connection of an optical transmission module, optical coupling surface and an optical axis center follow each other and thus stable optical transmission can be constantly performed.

Optical transmission module

The invention provides a heat radiating structure which reduces a mechanical stress applied to an electronic part mounted on a printed circuit board including a semiconductor package. The heat radiating structure is constructed by a semiconductor package mounted on a printed circuit board, a thermal conduction sheet arranged on an upper surface of the semiconductor package, and a metal case provided with a heat radiating fin for receiving a heat transmitted form the thermal conduction sheet so as to discharge to an atmospheric air, and the metal case is provided with a concavo-convex structure in a contact portion with the thermal conduction sheet.

Semiconductor device

An optical transmitter receiver module and an apparatus incorporating the same module are provided, which realizes the reduction of power consumption and the enlargement of the operating temperature range. As an example, an optical transmitter module is provided which comprises a light emitting element to generate a light signal, a signal processing circuit to transmit an electrical signal to the light emitting element and a voltage regulating circuit to lower a power voltage so as to supply the signal processing circuit with a constant voltage, wherein the module is further provided with a current regulating circuit to shunt a part of a current to be supplied into the voltage regulating circuit from a power source so as to generate a control current and a temperature controller to receive the control current so as to control a temperature of the light emitting element, wherein the module is further provided with a temperature detector to detect the temperature of the light emitting element and a temperature controlling circuit to control the control current according to an electrical signal output by the temperature detector.

Growing community of inventors

Odawara, Japan

Fumihide Maeda