Kyocera Corporation

Fumiaki Takeshita

Teruaki Nonoyama

Yousuke Moriyama

Kenichi Kohama

A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.

Electronic device mounting board, electronic package, and electronic module

An image sensor mounting base includes a substrate, and a first, a second, a third and a fourth electrode pad. The substrate has an upper surface including a first mount area where a first image sensor is mountable, and a second mount area where a second image sensor is mountable. The second mount area is spaced from the first mount area. The first and second electrode pads are located on the upper surface of the substrate and across the first mount area each other. The third and fourth electrode pads on the upper surface of the substrate are spaced from the first electrode pad and the second electrode pad and face each other across the second mount area. The substrate has, on the upper surface, a recess between the third electrode pad and the fourth electrode pad. The second mount area is located on a bottom of the recess.

Image sensor mounting base, imaging device, and imaging module

In one aspect of this disclosure, an electronic device mounting board includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has a first recess located on the first surface and a second recess located on the second surface. The substrate includes an electrode pad. The electrode pad is located in the first recess. The second recess in the substrate contains a reinforcement dividing the second recess into a plurality of recesses. The reinforcement is located separate from the electrode pad or is located to overlap the electrode pad in a plan view.

A imaging device includes a first insulating substrate having a through hole, a connection electrode and a first wiring conductor, a second insulating substrate having outside terminals and a second wiring conductor, and an imaging element including a light-receiving portion arranged at a center portion on an upper surface thereof and a connection terminal arranged at an outer peripheral portion thereof, at least one of the lower surface of the first insulating substrate and the upper surface of the second insulating substrate including a recess portion, the through hole being located on an inner side thereof, the imaging element being arranged below the first insulating substrate such that the light-receiving portion is located within the through hole, the connection terminal being electrically connected to the connection electrode, the imaging element being accommodated inside the recess portion, outer peripheral portions of the first insulating substrate and the second insulating substrate being electrically connected to each other.

Growing community of inventors

Esslingen, Germany

Fumiaki Takeshita