Nippon Oil Company

Fumiaki Oshimi

Yutaka Otsuki

Masami Enomoto

Hitoshi Yuasa

Susumu Kubota

Kazuo Matsuura

Nobuyuki Kuroda

Mituji Miyoshi

Masaomi Matsuzaki

A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Resin, process for preparing the same and compositon comprising the same

An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m&gt;x, R.sup.1 may each stand for different groups.

Composition of glycidylated phenol/vinylcyclohexene or vinylnorbornene

Resin, process for preparing the same, and composition comprising the

A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.

Phenolic resin, method for producing the resin and epoxy resin

A method is provided for producing a phenolic resin represented by the formula (I) ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a divalent cyclic hydrocarbon residue having 5 to 18 carbon atoms, p is a number of from 0 to 10 and q is a number of 1 or 2. The method involves reacting a phenol with an unsaturated cyclic hydrocarbon compound having two or more carbon-carbon double bonding in the presence of an acid catalyst; and processing a resulting reaction product by a hydrotalcite compound represented by the formula (II)

Method for producing phenolic resin

According to the present invention, there is provided a process for preparing polyolefins which comprises polymerizing or copolymerizing olefins using as catalyst a component consisting of a solid carrier and a titanium compound and/or a vanadium compound supported thereon, and an organometallic compound, said solid carrier consisting of a product obtained by mixing and heating an aluminum oxide and an ammonium sulfate.

Process for preparing polyolefins

A process of polymerizing or copolymerizing a class of olefins is carried out in the presence of a catalyst, which catalyst comprises one of more solid compounds selected as a carrier from the group consisting of an oxide, a double oxide and a hydroxide of halogen-free magnesium and/or calcium. The carrier is treated by direct contact with gaseous sulfur dioxide (SO.sub.2) under a gaseous atmosphere. A titanium and/or vanadium compound, viz. Ziegler catalyst component, is deposited on the treated carrier and activated by an organometal compound.

Growing community of inventors

Yokohama, Japan

Fumiaki Oshimi