Toray Industries, Inc.

Fumiaki Noma

Hajime Kishi

Tetsuyuki Kyono

Shoji Yamane

Masazumi Tokunoh

Toyokazu Minakuchi

Toshihide Sekido

Eisuke Wadahara

Kishio Miwa

Akihiko Kitano

Hiroaki Fukui

This invention relates to a method for manufacturing a large FRP member including: disposing a preform containing a reinforcing fiber on a surface of a molding die; covering a molding portion with a bagging material or a mold and providing a suction port and a resin injection port for sealing; evacuating the molding portion through the suction port; heating the molding portion; injecting a thermosetting resin from the resin injection port for impregnating the reinforcing fiber with the resin while a temperature Tm of the molding die and a temperature Tv of the bagging material or the mold are both set to room temperature or more, and a difference &#x394;T in temperature between the Tm and the Tv is set to 10&#xb0; C. or less; and curing the resin by maintaining the molding portion at a predetermined temperature Tpc which is equal to or more than room temperature.

Method for producing upsized FRP member

Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same

An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 10.sup.2 to 10.sup.6 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 .mu.m and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas impermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA., at the bonded surface in the thickness direction thereof.

Electroconductive integrated substrate and process for producing the same

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Matsuyama, Japan

Fumiaki Noma