Unitechno Corporation

Fumiaki Nanami

Shinichi Nakamura

The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion () adapted to receive therein an IC () having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet () pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad () formed on a front surface thereof and a socket side pad () formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion () is provided with a retaining latch () protruding therefrom toward above the IC () when the IC () is received in the inner peripheral wall () of the frame portion ().

Semiconductor transporting and testing fixture

A Kelvin inspection fixture is provided with contact probes, wherein the contact probe comprises an electrode side contact terminal in contact with a solder ball, and a land side contact terminal in contact with a land, and the contact probe comprises an electrode side contact terminal in contact with the solder ball, and a land side contact terminal in contact with a land. The contact probes are disposed so that an electrode side inclined face and an electrode side inclined face are held in an opposite relationship with respect to each other and so that a land side inclined face and a land side inclined face are held in a face to face relationship with respect to each other.

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Tokyo, Japan

Fumiaki Nanami