Sumitomo Special Metals Co., Ltd.

Neomax Co., Ltd.

Neomax Materials Co., Ltd.

Hitachi Metals, Ltd.

Neomax Material Co., Ltd.

Fumiaki Kikui

Takeshi Nishiuchi

Kohshi Yoshimura

Yoshimi Tochishita

Atsushi Kikugawa

Ken Asada

Masayuki Yokota

Masahiro Asano

Takahiro Isozaki

Mitsuo Kizawa

Ikuo Shimamoto

Shuji Tsujimoto

Kazumitsu Sato

Masako Ikegami

Masaaki Ishio

Kazuhiro Shiomi

Koshi Yoshimura

Kohshi Yosimura

Masuo Kondo

Yoriyoshi Oooka

Kaoru Kojima

Yoshimura Kohshi

There is provided a separator for a fuel cell having a very good anticorrosiveness and electrical conductivity. A separator for a fuel cell according to the present invention includes: a baseformed of a steel which contains 10.5 mass % or more of Cr; a metal filmformed on the surface of the base; and an intermediate layerformed between the baseand the metal film, the intermediate layercontaining oxygen. The metal filmis composed of at least one metallic element selected from the group consisting of Ta, Nb, and Ti, and the intermediate layercontains Fe and Cr which are contained in the steel and at least one metallic element selected from the group consisting of Ta, Nb, and Ti composing the metal film

Separator for fuel cell having intermediate layer and method for manufacturing same

A separator for a fuel cell according to the present invention includes: a basecontaining 70 mass % or more of Al; an underlying layerbeing formed on the base and containing Ti; an intermediate layerbeing formed on the underlying layer and containing TiNx or TiOy; and a conductive metal layerbeing formed on the intermediate layer and containing Au or Pt. The separator for a fuel cell according to the present invention has an excellent anticorrosiveness although a base containing aluminum as a main component is used.

Fuel cell separator and method for producing the same

An electroless Ni&#x2014;P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni&#x2014;P plating; providing a solid piece including Ni, Ni&#x2014;P, Co or Co&#x2014;Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni&#x2014;P plated coating on the surface of the island portions. Thus, the present invention provides a Ni&#x2014;P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni&#x2014;P plating on an industrial basis.

Electroless Ni-P plating method and substrate for electronic component

There is provided a fuel cell separator having a very good anticorrosiveness and electrical conductivity. A fuel cell separator includes: a base formed of a steel which contains 10.5 mass % or more of Cr; a metal film formed on the surface of the base; and an intermediate layer formed between the base and the metal film, the intermediate layer containing oxygen. The metal film is composed of Au or Pt, and the intermediate layer contains Fe and Cr which are contained in the steel and Au or Pt composing the metal film.

Fuel cell separator and method for manufacturing the same

A silver-coated ballaccording to the present invention includes: a spherical core; and a coating layerincluding silver superfine particles, which is arranged so as to surround the core. The silver superfine particles included in the coating layerhave a mean particle size of 1 nm to 50 nm.

Silver-coated ball and method for manufacturing same

A Cu&#x2014;Mo substrateaccording to the present invention includes: a Cu basecontaining Cu as a main component; an Mo base having opposing first and second principal facesand containing Mo as a main component, the second principal faceof the Mo basebeing positioned on at least a portion of a principal faceof the Cu base; and a first Sn&#x2014;Cu-type alloy layercovering the first principal faceand side facesandof the Mo base, the first Sn&#x2014;Cu-type alloy layercontaining no less than 1 mass % and no more than 13 mass % of Sn.

Cu-Mo substrate and method for producing same

A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.

Copper plating solution and method for copper plating

An object of the present invention is to provide a method for forming a uniform and dense electroplating film with high adhesion strength on the surface of an article, yet irrespective of the surface material and the surface properties of the article. A means for a solution of the problem comprises: forming on the surface of the article, a resin coating made of a resin containing dispersed therein a powder of a first metal; then forming a second-metal substituted plating film on the surface of the resin coating by immersing the resin-coated article in a solution containing ions of a second metal having an ionization potential nobler than that of the first metal; and further forming an electroplating film of a third metal on the surface of the metal-substituted plating film.

Method for forming electroplating film on surfaces of articles

A surface treating process according to the present invention, a vapor deposited film is formed from an easily oxidizable vapor-depositing material on the surface of a work by evaporating the vapor-depositing material in a state in which the vapor deposition controlling gas has been supplied to at least zones near a melting/evaporating source and the work within a treating chamber. Thus, the vapor deposited film can be formed stably on the surface of a desired work without requirement of a long time for providing a high degree of vacuum and without use of a special apparatus. In addition, the use of the surface treating process ensures that a corrosion resistance can be provided to a rare earth metal-based permanent magnet extremely liable to be oxidized, without degradation of a high magnetic characteristic of the magnet. A surface treating apparatus according to the present invention includes a melting/evaporating source for melting and evaporating a wire-shaped vapor-depositing material containing a vapor deposition controlling gas, and a member for retaining a work on which the vapor-depositing material is deposited. The melting/evaporating source and the work retaining member are disposed in a treating chamber of the surface treating chamber. The apparatus further includes a vapor-depositing material supply means for supplying the wire-shaped vapor-depositing material containing the vapor deposition controlling gas to the melting-evaporating source.

Surface treating apparatus

A solder ballaccording to the present invention includes a spherical coreand a solder layer, which includes Sn and Ag and which is provided so as to wrap the coreup. The amount of water contained in the solder layeris 100 &#x3bc;l/g or less when represented by the amount of water vapor in standard conditions.

Method of making a solder ball

A rare earth metal-based permanent magnet has a film layer formed substantially of only a fine metal powder on a metal forming the surface of the magnet. The rare earth metal-based permanent magnet having the film layer on its surface is produced in the following manner: A rare earth metal-based permanent magnet and a fine metal powder forming material are placed into a treating vessel, where both of them are vibrated and/or agitated, whereby a film layer made of a fine metal powder produced from the fine metal powder producing material is formed on a metal forming the surface of the magnet. Thus, the formation of a corrosion-resistant film such as plated film can be achieved at a high thickness accuracy by forming an electrically conductive layer uniformly and firmly on the entire surface of the magnet without use of a third component such as a resin and a coupling agent.

Rare earth metal-based permanent magnet, and process for producing the same

With the deposited-film forming apparatus according to the first embodiment of the present invention, the distance between the tubular barrel and the evaporating section can be varied, unlike the prior art deposited-film forming apparatus and hence, the efficient formation of the deposited film on the surface of each of the work pieces accommodated in the tubular barrel and the inhibition of the softening of the formed film can be achieved simultaneously. Therefore, it is possible to inhibit the damaging of the deposited film formed on the surface of each of the work pieces and the production of projections on the deposited film, and to form a deposited film at a high quality in respect of a corrosion resistance and the like and at low cost. With the deposited-film forming apparatus according to the second embodiment of the present invention, the distance between the accommodating section defined in the tubular barrel and the evaporating section can be varied and hence, this deposited-film forming apparatus also exhibits an effect similar to that in the deposited-film forming apparatus according to the first embodiment of the present invention.

Deposited-film forming apparatus

An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.

Electroplating device, and process for electroplating work using the device

The chemical conversion film containing, at least as the constituent components thereof, (a) at least one of the metals selected from molybdenum, zirconium, vanadium, and tungsten; (b) a rare earth metal constituting the magnet; and (c) oxygen, which is formed on the surface of a rare earth metal-based permanent magnet according to the present invention, contains a composite metal oxide provided on the surface of the R-rich phase having a lower oxidation-reduction potential through a preferential reaction of the metallic ions that are present in the form of complex ions or oxide ions, such as of molybdenum, contained in the treatment solution, with the rare earth metals that elute from the magnet. Thus formed composite metal oxide reduces the difference in corrosion potential as to realize a uniform surface potential, and effectively suppresses the corrosion based on potential difference. Furthermore, the chemical conversion film thus formed exhibits excellent corrosion resistance even if it is provided as a thin film. The production method thereof can be implemented at low cost and by a simple process comprising treating the surface of the magnet by using a treatment solution containing a molybdate and the like.

Growing community of inventors

Osaka, Japan

Fumiaki Kikui