Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Ube Cycon, Ltd.

Fumiaki Baba

Akira Yamada

Shoji Yamaguchi

Shinji Yamagata

Hiroshi Adachi

Katsunori Ochi

Masaru Takada

Koji Kise

Takao Mitsuhashi

Hajime Sotokawa

Tetsuo Mitani

Kazunori Fukuya

Takanori Imai

Kazuharu Kato

Shinya Tokizaki

Kenichi Nishina

Shunichi Katsube

Itsuo Nishiyama

Yuichi Ishimaru

Yuichi Matsuo

Mitsuhiko Ohira

Hidemoto Arai

Osamu Hiroi

Syojiro Kodai

Tadaki Murakami

Yasuo Furuhashi

Shojiro Kodai

Kouji Hirata

Sumihisa Akahoshi

Mitugu Takahasi

Chisa Kato

Masanori Tsujihara

Yutaka Igarashi

Makoto Fukaya

Kazuo Nakamura

Hiroyuki Sato

Mitsugu Takahashi

Masaru Shinozaki

Satoru Yamasaki

Motoki Masaki

Takamitsu Fujimoto

Satoshi Yanaura

Makoto Kobayashi

Takeji Fujiwara

Atsuko Noda

Tosikazu Uemoto

Shiro Takatani

Tsutomu Ohta

Tsuguo Kurisu

Katsuyoshi Iisaka

A radio wave absorber includes hexagonal ferrite particles and a holding material-filled with the hexagonal ferrite particles. The hexagonal ferrite particles include first particles and second particles that are larger than the first particles in particle size.

Radio wave absorber

The present invention relates to a heat exchange element in which unit constituent members, each of which includes a partition member that has a heat-transfer property and a moisture permeability and a spacing member that holds the partition member with a predetermined spacing, are stacked and in which a primary air flow that passes along an upper surface side of the partition member and a secondary air flow that passes along an undersurface side of the partition member and crosses the primary air flow exchange heat and moisture through the partition member, wherein a detachment suppressing rib is provided on the opposite side of the spacing member when viewed from the partition member at a bonded portion between the partition member and the spacing member, and the partition member is sandwiched by the spacing member and the detachment suppressing rib.

Heat exchange element

Provided is a heat exchange element that suppresses an increase in air-flow resistance by suppressing deflection of a partition member caused by a change in temperature and humidity. The unit constituent members are stacked, each of which is formed of partition members that have heat-transfer properties and moisture permeability, and spacing members that hold the partition members. A primary air flow that passes along an upper-surface side of the partition member and a secondary air flow that passes along an undersurface side of the partition member cross each other so as to exchange heat and moisture via the partition member. The spacing member includes: spacing ribs that maintain the spacing between the partition members; and deflection suppressing ribs that have a height smaller than the spacing ribs so as to suppress deflection of the partition members.

Heat exchange element and air conditioner

A switch having a molded article of which the entirety or a part is composed of an organic and inorganic complex composition is provided, wherein the base inside of the base of a box is composed of for example an organic and inorganic complex composition with the resin content at 15 to 70 wt % and the content of one or more inorganic compounds capable of dehydration at 150&deg; C. or more at 80 to 30 wt %.

Organic and inorganic complex compound and switch using same

A switch containing a switch case, contacts adapted to be opened and closed, an arc extinguishing chamber disposed in the vicinity of the contacts, and an arc extinguishing material capable of reducing the amount of metal particles and free carbons to be scattered from components disposed within the switch by an arc generated when the contacts are opened or closed or capable of insulating the metal particles and the free carbons to convert into an insulator, thereby inhibiting a decrease in arc resistance expected to occur upon the generation and extinction of the arc and a decrease in insulation resistance expected to occur within and around the arc extinguishing chamber and at inner wall surfaces of the switch case upon and after the extinction of the arc. The switch is applicable to a switch expected to generate an arc upon interruption of electric current flowing therethrough such as a circuit breaker, current-limiting device or electromagnetic contactor and is capable of immediately extinguishing the arc and inhibiting the decrease in insulation resistance within and around the arc extinguishing chamber and at inner wall surfaces of the switch case.

Switch and arc extinguishing material for use therein

A heat insulating box, such as a refrigerator box, comprises a heat insulator and a box member that is in contact with the heat insulator. The heat insulator is formed of a urethane foam using either HCFC-123 (CHCl.sub.2 CF.sub.3) or HCFC-141b (CH.sub.3 CCl.sub.2 F) or both as a forming agent, and the box member is formed of a styrene/acrylonitrile/butadiene terpolymer, a styrene/ethylene-.alpha.-olefinic rubbery copolymer/acrylonitrile terpolymer (AES resin), a styrene/alkyl acrylate ester containing rubbery copolymer/acrylonitrile terpolymer (AAS resin), or a mixture of the AES resin and the AAS resin.

Heat insulating box

A switch comprising a switch case, contacts adapted to be opened and closed, an arc extinguishing chamber disposed in the vicinity of the contacts, and an arc extinguishing material capable of reducing the amount of metal particles and free carbons to be scattered from components disposed within the switch by an arc generated when the contacts are opened or closed or capable of insulating the metal particles and the free carbons to convert into an insulator, thereby inhibiting a decrease in arc resistance expected to occur upon the generation and extinction of the arc and a decrease in insulation resistance expected to occur within and around the arc extinguishing chamber and at inner wall surfaces of the switch case upon and after the extinction of the arc. The switch according to the present invention is applicable to a switch expected to generate an arc upon interruption of electric current flowing therethrough such as a circuit breaker, current-limiting device or electromagnetic contactor and is capable of immediately extinguishing the arc and inhibiting the decrease in insulation resistance within and around the arc extinguishing chamber and at inner wall surfaces of the switch case.

A heat insulating box, such as a refrigerator box, comprises a heat insulator and a box member that is in contact with the heat insulator. The heat insulator is formed of a urethane foam using either HCFC-123 (CHCl.sub.2 CF.sub.3) or HCFC-141b (CH.sub.3 CCl.sub.2 F) or both as a forming agent, and the box member is formed of an acrylonitrile/ethylene-.varies.-olefinic rubbery polymer/styrene resin (A/epdm/S resin), an acrylonitrile/alkyl acrylate ester rubbery polymer/styrene resin (ASA resin), a mixture of an A/epdm/s resin and an ASA resin, or a mixture of an ASA resin with an acrylonitrile/butadiene/styrene resin.

An apparatus for producing a multi-layer printed circuit board. The printed circuit board includes a bottom layer board, a hole board, and an adhesive sheet between the bottom layer board and the hole board. The printed circuit board is heated so that adhesive sheet bonds the bottom layer board to the hole board. A mold release sheet and a thermoplastic resin sheet begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

Method for manufacturing multi-layer printed board

Resin compound for molding precision parts, and sleeve and ferrule

A method for producing multi-layer printed board. The method includes heating a hole board as a top layer, an adhesive sheet, and a bottom layer board. The adhesive sheet includes a mold release sheet and a thermoplastic resin sheet which begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.

Portable semiconductor device with resin

The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.

Moistureproof structure for module circuits

A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both sides of the board to a thickness no greater than the frame thickness.

Method for manufacturing an encapsulated IC card having a molded frame

Growing community of inventors

Amagasaki, Japan

Fumiaki Baba