Mitsubishi Denki Kabushiki Kaisha

Renesas Technology Corp.

Fumiaki Aga

Hideyuki Arakawa

Hidetoshi Kuraya

Hiroshi Horibe

Namiki Moriga

Yasuhito Suzuki

Akira Takaki

A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire satisfies a condition: (modulus-of-elasticity/breaking strength per unit area)&#x2267;400.

Semiconductor device and method of manufacturing the same

A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire satisfies a condition: (modulus-of-elasticity/breaking strength per unit area) &#x2267;400.

A semiconductor device comprises a semiconductor chip. The semiconductor chip has an internal active region, an external active region, and a plurality of electrodes for electrically connecting the internal active region and the external active region to outside thereof, respectively. The semiconductor device also comprises a boarding portion that carries the semiconductor chip, a plurality of external electrode terminals for electrical connection to an external device, a plurality of connecting wires each connecting the electrode of the semiconductor chip and the external electrode terminal; and a mold resin that seals the semiconductor chip, the boarding portion and the connecting wires. The electrodes are disposed around the internal active region, and the external active region is disposed outside the electrodes.

Semiconductor device

There is provided a resin composition having high flame retardancy, which improves high temperature storage of an epoxy resin composition comprising an epoxy resin having biphenyl structure without a halogenated flame retardant and an antimony compound as a conventional flame retardant. High temperature storage was improved, a glass transition temperature (Tg) became not less than 150&deg; C. and V-0 class in flame retardance standard (UL94) was accomplished by employing (1) an epoxy resin having biphenyl structure mainly as an epoxy resin, (2) a phenolic aralkyl resin mainly as a curing agent, (3) 0.5 to 30 parts by weight of a polyimide resin as an additive based on total 100 parts by weight of the epoxy resin and the curing agent, (4) a polysiloxane compound modified with polyether containing an amino group as a flame retardant, (5) not less than 87% by weight of a fused silica as an inorganic filler based on the total composition.

Growing community of inventors

Tokyo, Japan

Fumiaki Aga