Sae Magnetics (h.k.) Limited

Cloud Light Technology Limited

Fuk Ming Lam

Vincent Wai Hung

Dennis Tak Kit Tong

Francis Guillen Gamboa

Chi Yan Wong

Masanori Goto

Victor Pak Hong Ng

Hau Chen Loke

Jun Ming Bai

An optical subassembly structure for mode conversion by an active alignment of an optical fiber with a semiconductor optical waveguide includes a sub-mount for holding the optical subassembly structure, a semiconductor die mounting on the sub-mount, the semiconductor optical waveguide growing on the semiconductor die and a glass capillary subassembly actively aligned to the semiconductor optical waveguide.

Optical subassembly structure

A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.

Printed circuit board

A multi-layer printed circuit board includes an insertion end, two edge fingers provided on the insertion end, two chamfers formed at two opposite inner corners at two trailing edges of the two edge fingers, and two single-ended transmission lines extending from the two trailing edges of the two edge fingers and converging towards each other to form a differential pair. A first ground reference plane is disposed underneath the two single-ended transmission lines and the differential pair with a leading edge terminates at the trailing edges of the two edge fingers and a first cut-out portion formed at the leading edge. Other ground reference planes are disposed underneath the first ground reference plane with leading edges terminate at the trailing edges of the edge fingers and second cut-out portions are formed at the leading edges, wherein the second cut-out portions are larger than the first cut-out portion.

Edge fingers of multi-layer printed circuit board

A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.

Serial electrical connector

A printed circuit board includes a first conductive layer that includes a first transmission line portion and two soldering pads, a first insulating layer disposed under the first conductive layer, a fourth conductive layer disposed under the first insulating layer and including a second transmission line portion, two through-hole vias respectively disposed across the first insulating layer, and two capacitors respectively connecting the first transmission line portion and the two soldering pads. The two through-hole vias are directly connected with the two soldering pads and extending the connection to the second transmission line portion respectively.

An active optical connector using an audio port includes a plug insertable into a jack having an optical transceiver module. A conductor is mounted on the plug. Optical fibers extend through a central bore of the plug and have front ends held in a fiber ferrule. The jack has a terminal for contacting the conductor on the plug. The optical transceiver module has a receptacle for receiving the fiber ferrule. A light source emits light to an optical fiber, and a photo-detector receives light from another optical fiber. A controller chip has a converting circuit configured to convert electrical signals into optical signal and optical signals into electrical signals.

Growing community of inventors

Hong Kong, China

Fuk Ming Lam