Jsr Corporation

Jm Energy Corporation

Fujio Sakurai

Yukio Hosaka

Ryo Tanaka

Yoshinori Igarashi

Kou Hasegawa

Takahiro Shimizu

Kouji Senoo

Satoshi Shimobaba

Nobuyuki Miyaki

Yuuichi Eriyama

Motoki Okaniwa

Kouji Kawahara

Kenji Kojima

Masahiro Yamamoto

Tomoo Koumura

Kang Ko Chung

Iwao Mihara

The present invention relates to an electrode material, an electrode, an electrical storage device and a lithium-ion capacitor, and the electrode material includes a carbon material and reduces its weight at a temperature not more than 650&#xb0; C. by 20% relative to the weight thereof before heating when thermogravimetric analysis is performed on the electrode material with a heating rate of 5&#xb0; C./min in an air flow at a rate of 100 ml/min.

Electrode material, electrode and electrical storage device

The present invention relates to a production process for an electrode material, an electrode and an electric storage device, and the production process for an electrode material comprises a step of heating a polymer having a silicon-containing unit and a silicon-non-containing unit.

Production process for electrode material, electrode and electric storage device

There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as &#x3b2;-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4'-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Polishing pad and production method thereof

A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30&#xb0; C. to the storage elastic modulus at 60&#xb0; C. of 2 to 15 and a ratio of the storage elastic modulus at 30&#xb0; C. to the storage elastic modulus at 90&#xb0; C. of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.

Polishing pad

A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect of reducing the number of scratches. This polishing pad has one or more grooves on its polishing surface, wherein the groove(s) is/are formed in the polishing surface in such a manner that it/they intersect(s) a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface a plurality of times and has/have a width of 0.1 to 1.5 mm and a depth of 0.9 to 9.8 mm, the shortest distance between adjacent intersections between it/them and the virtual straight line is 0.3 to 2.0 mm, and the ratio of the depth of the groove(s) to the thickness of the polishing pad is 1/7 to 1/1.1.

Chemical mechanical polishing pad

Growing community of inventors

Minato-ku, Japan

Fujio Sakurai