Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Fujio Kojima

Yorio Iwasaki

Shigeharu Arike

Yasushi Shimada

Toshiro Okamura

Hiroharu Kamiyama

Eisaku Namai

Naoki Fukutomi

Hidehiro Nakamura

Masao Kanno

A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

Process for producing coaxial conductor interconnection wiring board

A coaxial conductor interconnection wiring board includes at least one coaxial conductor and at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor. The conductive shield of the coaxial conductor is connected to the ground layer by connection metal layers. A conductor insulating layer surrounds the metallized conductor hole and the connection metal layers surround a part of the additional conductor insulating layer. Thus, the conductive hole, insulating layer, and connection metal layers function as a coaxial conductor.

Coaxial conductor interconnection wiring board

A high-density wired circuit board obtained by providing an auxiliary grid at the position of centroid of a main grid and by employing wiring in the inclined direction mainly instead of wiring in the XY directions mainly can make the space between wires and through-holes large without narrowing a wiring pitch.

High-density wired circuit board using insulated wires

Growing community of inventors

Shimodate, Japan

Fujio Kojima