Sony Corporation

Sony Computer Entertainment Inc.

Fujio Kanayama

Kazuyoshi Yamada

Tsuyoshi Ogawa

Hidetoshi Kusano

Yuji Nishitani

Hirohito Miyazaki

Tomoshi Ohde

Mitsuru Adachi

Toru Terada

Tetsunori Niimi

Shuichi Otaki

An optical communication fiber includes: a fiber body having a tip surface; and a light absorption layer provided to the tip surface of the fiber body, and configured to reduce light transmittance of communication light.

Optical communication fiber, optical communication module, and optical communication system

An optical fiber cable processing device includes a transport mechanism which transports a case that accommodates an optical fiber cable and in which plural work stations are set along a transport path, and a processing mechanism that performs each of desired operations on the optical fiber cable, in which any one of the plural work stations is a mounting station in which a work mounting mechanism mounts a work on a tip of the optical fiber cable, a drawing mechanism that draws out the optical fiber cable and a correction mechanism that corrects a bending tendency of the optical fiber cable are disposed in the work stations on an upstream side of the mounting station, and the transport mechanism transports the case to the mounting station and mounts the work on the tip of the optical fiber cable in a state where the optical fiber cable is drawn out.

Optical fiber cable processing device, method for processing the same, and case for optical fiber cable

A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Semiconductor device and method of manufacturing semiconductor device

Growing community of inventors

Kanagawa, Japan

Fujio Kanayama