Skymedi Corporation

Fuja Shone

Chih Nan Yen

Yung Li Ji

Yi-Ching Liu

Ming-Hung Chou

I-Long Lee

Chuang Cheng

Wen-Lin Chang

Chien-Fu Huang

Chien Lin

Chih-Nan Yen

Yung-Li Ji

Yu-Mao Kao

Hsin-Chien Chen

Shih Chieh Tai

Shih-Chieh Tai

Ching-Chang Chen

Satoshi Sugawa

Kai-Hsun Lin

Szu I Yeh

Yu Mao Kao

Hsin Jen Huang

Chia Chen Chang

Chih Wei Tsai

Chia Hao Lee

Chih Cheng Tu

An operation method of a memory includes the steps of calculating an offset of sequential write commands and the beginning of pages of a block of a non-volatile memory; shifting the block by the offset; and directly writing data from a host to the pages except the first and last pages of the block by the sequential write commands. In an embodiment, the pages are logical pages providing optimal writing efficiency and are determined before calculating the offset. The step of shifting the block by the offset is to increase corresponding logical block addresses (LBA) in the pages by the offset.

Method for sequentially writing data with an offset to a non-volatile memory

A non-volatile memory storage device has a non-volatile memory, e.g., a flash memory, and a controller coupled to the non-volatile memory. The controller comprises a plurality of control circuits and an arbitration circuit. Each control circuit is configured to generate a request to update the chip-enable (CE) signals for non-volatile memory, and the arbitration circuit is configured to determine when the requests are acknowledged. The arbitration circuit generates acknowledge signals to the control circuits when all of the requests of the control circuits have been received by the arbitration circuit. The CE signals for non-volatile memory are updated when requests are acknowledged.

Non-volatile memory storage device and operation method thereof

A hierarchical mechanism for preventing concentrated wear on single physical block or a specific set of physical blocks in the physical memory is proposed. The logical blocks mapping to the physical blocks in the physical memory are classified into two different levels for implicitly representing the modification times of the physical blocks. A modify count and a maximum modify count are further included for counting the modification times in a single process of the hierarchical mechanism and for limiting the modification times in single process, leading to the probabilities of all the physical blocks being modified in the physical memory being balanced. The breakdown of the physical memory caused by the breakdown of a specific set of physical blocks or single physical block is thus prevented.

Method for enhancing life cycle of memory

A method of wear leveling for a non-volatile memory is disclosed. A non-volatile memory is divided into windows and gaps, with each gap between two adjacent windows. The windows comprise physical blocks mapped to logical addresses, and the gaps comprise physical blocks not mapped to logical addresses. The windows are shifted through the non-volatile memory in which the mapping to the physical blocks in the window to be shifted is changed to the physical blocks in the gap.

Method of wear leveling for non-volatile memory and apparatus using via shifting windows

A wear leveling limit and/or an overall erase count threshold used for activating wear leveling in a non-volatile memory may be adjusted by determining a stage according to a highest erase count, and determining the wear leveling limit and/or the overall erase count threshold corresponding to the stage. Wear leveling may then be performed according to the wear leveling limit and/or the overall erase count threshold.

Method of performing wear leveling with variable threshold

A method and related system for programming connections between a NAND flash memory controller and a plurality of NAND flash memory modules includes the NAND flash memory controller generating a switch signal and a swap signal according to a condition of one of the plurality of NAND flash memory modules, a remap module selectively coupling the plurality of NAND flash memory modules to the NAND flash memory controller according to the switch signal, and a swap module selectively coupling the plurality of NAND flash memory modules to the NAND flash memory controller according to the swap signal.

NAND flash memory system with programmable connections between a NAND flash memory controller and a plurality of NAND flash memory modules and method thereof

An operation method for a non-volatile memory structure formed between two doping regions serving as bit lines in a semiconductor substrate, the non-volatile memory structure comprising a first conductive line serving as a select gate and being formed above the semiconductor substrate, two conductive blocks serving as floating gates and being formed at the two sides of the first conductive line and insulated from the first conductive line with two first dielectric spacers therebetween, a first dielectric layer formed on the two second conductive blocks, a second conductive line serving as a word line and being formed on the first dielectric layer and substantially perpendicular to the two doping regions. While reading the programmed status of one of the conductive blocks, a bias voltage is applied to the doping region next to the conductive block to be read, a bias voltage is applied to the second conductive line, and a bias voltage is applied to the first conductive line next to the conductive block to be read, so as to turn on the select gate and form an inversion layer underneath the select gate; and the doping region, the channel under the conductive block and the inversion layer under the select gate form a reading path during the reading operation.

Asymmetric operation method of non-volatile memory structure

A method for managing defect blocks in a non-volatile memory essentially comprises the steps of detecting defect blocks in the non-volatile memory, storing addresses of the defect blocks in a table block of the non-volatile memory, and setting the non-volatile memory to be read-only if the quantity of defect blocks in the non-volatile memory exceeds a threshold and no free blocks remain in the non-volatile memory. In a preferred embodiment, the free pages in the defect block continue to be programmed before setting the non-volatile memory to be read-only.

Method for managing defect blocks in non-volatile memory

A memory structure in a semiconductor substrate essentially comprises a first conductive line, two conductive blocks, two first dielectric spacers, a first dielectric layer, and a second conductive line. The first conductive line, e.g., a polysilicon line, is formed above the semiconductor substrate, and the two conductive blocks composed of polysilicon, for example, are formed at the two sides of the first conductive line and insulated from the first conductive line with the two first dielectric spacers. The first dielectric layer, such as an oxide/nitride/oxide (ONO) layer, is formed on the two second conductive blocks and above the first conductive line, and the second conductive line is formed on the first dielectric layer and is substantially perpendicular to the two doping regions. Accordingly, the stack of the conductive block, the first dielectric layer, and the second conductive line form a floating gate structure which can store charges. The first conductive line and conductive blocks function as a select gate and floating gates, respectively, whereas the doping regions and the second conductive line function as bit lines and a word line, respectively.

Symmetrical and self-aligned non-volatile memory structure

A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Method of programming a nonvolatile memory cell and related memory array

A read method for multiple-value information in a semiconductor memory such as a nonvolatile semiconductor memory is introduced. The method includes obtaining a first data from a selected multiple-value memory cell by applying a first voltage to a control gate of the selected multiple-value memory cell. A second data from the selected multiple-value memory cell is obtained by applying a second voltage to the control gate of the selected multiple-value memory cell. A first bit of the plurality of bits stored in the selected multiple-value memory cell is then obtained by performing a predetermined calculation on the first data and the second data. A second bit of the plurality of bits is obtained from the selected multiple-value memory cell by applying a third voltage to the control gate of the selected multiple-value memory cell.

Method for reading multiple-value memory cells

A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Method for reading a memory array with a non-volatile memory structure

A vertical split gate memory cell of silicon-oxide-nitride-oxide-silicon (SONOS) type formed in a trench of a semiconductor substrate includes a first doping region, a second doping region, a conductive line, a conductive plug, a first insulating layer and a second insulating layer, wherein the conductive line and conductive plug serve as a select gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed in the bottom of the trench and in operation relation to the first doping region. The first insulating layer is between the conductive line and the first doping region for insulation. The conductive plug is formed above the conductive line, and insulated from the conductive line by the second insulating layer. As to the formation of isolating plugs, for example, composed of CVD oxide, between memory cells, it can be done by etching conductive lines into holes and filling up the holes with CVD oxide or by filling the trenches with oxide between memory cells first.

Vertical memory cell and manufacturing method thereof

A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.

Programming and manufacturing method for split gate memory cell

A vertical split gate memory formed in a trench of a semiconductor substrate comprises a first doping region, a second doping region, a conductive line, a conductive spacer and a conductive plug, wherein the conductive line, conductive spacer and conductive plug serve as a select gate, a floating gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed at the bottom of the trench and in operation relation to the first doping region. The conductive spacer is formed beside the sidewall of the trench and above the conductive line. The conductive plug is insulated from the conductive spacer and the conductive line and in operation relation to the conductive spacer.

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Hsinchu, Taiwan

Fuja Shone