International Business Machines Corporation

Lockheed Martin Corporation

Fuad Elias Doany

Clint Lee Schow

Rama Nand Singh

Benjamin G Lee

Evan G Colgan

Alessandro Cesare Callegari

Alexander V Rylyakov

Alan Edward Rosenbluth

Thomas Mario Cipolla

Mark Delorman Schultz

Bruce Kenneth Furman

Daniel Michael Kuchta

George L Chiu

Janusz S Wilczynski

Sampath Purushothaman

Christopher Vincent Jahnes

Jane M Shaw

Chandrasekhar Narayan

Derek Brian Dove

Mehmet Soyuer

Da-Yuan Shih

Frank Robert Libsch

George Frederick Walker

Daniel J Stigliani, Jr

Guy M Cohen

Paul William Coteus

Russell Alan Budd

Brian Samuel Beaman

Masaru Suzuki

Todd Edward Takken

Shawn Anthony Hall

Shurong Tian

Jeannine Madelyn Trewhella

Laurent Schares

Dimitri Kanevsky

Keith E Fogel

Michael S Gordon

Cyril Cabral, Jr

Reinaldo Ariel Vega

Kenneth Parker Rodbell

Paul Alfred Lauro

Bucknell Chapman Webb

Gareth Geoffrey Hougham

Thomas M Shaw

Xiao Hu Liu

Minhua Lu

Naftali Eliahu Lustig

Harold John Hovel

Alexander Zlatsin

Li-Wen Hung

Leathen Shi

Ravi F Saraf

Praveen Chaudhari

Qiang Huang

Shui-Chih Alan Lien

James Patrick Doyle

James Andrew Lacey

Gregory M Fritz

Eric Peter Lewandowski

Alphonso Philip Lanzetta

David Earle Seeger

Maurice Heathcote Norcott

Kei-Hsiung Yang

Modest M Oprysko

John J Ritsko

Douglas Andrew Buchanan

Alina Deutsch

Marc A Taubenblatt

Eileen Ann Galligan

Clifford A Pickover

Gary W Grube

Peter Alfred Gruber

John Peter Karidis

Marie Angelopoulos

Robert J Von Gutfeld

Evgeni Petrovich Gousev

Yoichi Taira

Stephen L Buchwalter

Carlos Juan Sambucetti

Ferdinand Hendriks

Chin-Long Chen

Zon-Yin Shae

Satoshi Maruyama

Claudius Feger

David Hirsch Danovitch

Nicolas Dupuis

Jonathan E Proesel

Belle L Tseng

Daniel Peter Morris

Stephan Alan Cohen

Douglas S Goodman

Nancy C LaBianca

Xiping Wang

Douglas Craig Bossen

Edward D Babich

Revathi Iyengar

Mu-Yue Hsiao

Robert Lee Melcher

Ronald R Troutman

Raul E Acosta

An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Co-packaged optical module

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Conductive heat spreader and heat sink assembly for optical devices

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

High-density, fail-in-place switches for computer and data networks

A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic radiation. The first substrate is irradiated with the electromagnetic radiation to which the first substrate is transparent, such that the electromagnetic radiation impinges on the material causing a decomposition thereof at a location at an interface between the first substrate and the material. The decomposition results in, at the location, an interface of the first substrate and an atmosphere of the decomposition. The atmosphere of the decomposition has an optical property resulting in ceasing the decomposition of the material.

Damage-free self-limiting through-substrate laser ablation

A data readout device is provided and includes a reflective base, reflective sidewalls disposed about the reflective base and an actuation system. The actuation system is configured to modify relative positioning of one of the reflective base and the reflective sidewalls to either reflect incoming radiation back toward an origin thereof or to reflect the incoming radiation away from the origin thereof.

Tag with tunable retro-reflectors

A photonic waveguide structure for performing polarization rotation includes a first waveguide layer including input and output waveguides. The input and output waveguides are separate and discontinuous structures. The input and output waveguides are configured in the first waveguide layer to have a lateral offset therebetween. The photonic waveguide structure further includes a second waveguide layer including a waveguide structure disposed under or over the first waveguide layer. The waveguide structure includes a polarization conversion region configured within the second waveguide layer to overlap the input or output waveguides in the first waveguide layer.

Polarization rotator for silicon photonics

Aspects of the invention are directed to a method for forming an optical waveguide structure. Initially, a base film stack is received with an optical waveguide feature covered by a lower dielectric layer. An etch stop feature is then formed on the lower dielectric layer, and an upper dielectric layer is formed over the etch stop feature. Subsequently, a trench is patterned in the upper dielectric layer and the etch stop feature at least in part by utilizing the etch stop feature as an etch stop. Lastly, a waveguide coupler feature is formed in the trench, at least a portion of the waveguide coupler feature having a refractive index higher than the lower dielectric layer and the upper dielectric layer. The waveguide coupler feature is positioned over at least a portion of the optical waveguide feature but is separated from the optical waveguide feature by a portion of the lower dielectric layer.

Optical waveguide structure with waveguide coupler to facilitate off-chip coupling

An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.

Through-substrate optical coupling to photonics chips

A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.

Controlling fragmentation of chemically strengthened glass

Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.

Near-threshold optical transmitter pre-distortion

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Katonah, NY, United States of America

Fuad Elias Doany