Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Zhen Ding Technology Co., Ltd.

Fukui Precision Component (shenzhen) Co., Ltd.

Garuda Technology Co., Ltd.

Fukui Precison Component (shenzhen) Co., Ltd.

Fu-Yun Shen

Ming-Jaan Ho

Hsiao-Ting Hsu

Xian-Qin Hu

Wen-Zhu Wei

Yi-Qiang Zhuang

Cong Lei

Yong-Chao Wei

Hong-yan Guo

Jian Luo

Lin-Jie Gao

Li-Kun Liu

Fu-Wei Zhong

Tao-Ming Liao

Zhi-Tian Wang

Bo Ming

Katsumi Fujiwara

Feng-Yuan Hu

Shao-Hua Wang

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

Heat equalization plate

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

Pressure sensing circuit board and method for manufacturing the same

A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Methods of manufacturing circuit board and circuit board assembly

A covering film () includes a first covering layer (), a first adhesive layer (), and a thermal conductive layer () sandwiched between the first covering layer () and the first adhesive layer (). A thermal conductivity of the thermal conductive layer () is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer () is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer () is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Covering film, and circuit board and manufacturing method

A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Circuit board with heat dissipation structure and method for manufacturing same

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (), a second circuit board (), at least one third circuit board (), a fourth circuit board (), a fifth circuit board (), and a sixth circuit board (); stacking the first circuit board (), the second circuit board (), and third circuit board () in that order, and stacking the fourth circuit board (), the sixth circuit board (), and the fifth circuit board () on the third circuit board (), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Circuit board for transmitting high-frequency signal and method for manufacturing the same

A method for manufacturing a circuit board () includes: providing a first single-sided circuit substrate () including an insulating base layer () and a circuit layer (); forming first conductive posts () electrically connected to the circuit layer () in the insulating base layer () to obtain a second single-sided circuit substrate (); providing a first adhesive layer (), forming second conductive posts (); providing one second single-sided circuit substrate (), defining a receiving groove () to obtain a third single-sided circuit substrate (); providing another first single-sided circuit substrate (), mounting an electronic component () on the circuit layer () to obtain a surface mounted circuit substrate (); stacking the first single-sided circuit substrate (), the first adhesive layer (), the second single-sided circuit substrate (), at least one of the third single-sided circuit substrate (), and the surface mounted circuit substrate () in that order; pressing the intermediate body ().

Circuit board with embedded electronic component and method for manufacturing the same

A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Method for manufacturing transmission circuit board

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Method for manufacturing the same

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

Heat equalization plate and method for manufacturing the same

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Circuit board and manufacturing method thereof

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Method of manufacturing circuit board

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Method for making a heat dissipation structure

A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.

Electromagnetic shielding film

A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

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Shenzhen, China

Fu-Yun Shen