Orient Semiconductor Electronics, Limited

Other

Eason Tech. Co., Ltd.

Fu-Yu Huang

Chia-Chieh Hu

Hui-Pin Chen

Ning Huang

Chung-Ming Chang

Wen-Lo Shieh

Feng-Chang Tu

Feng-Hui Kuan

Hua-Wen Chiang

Min-Chun Lin

Wen-Long Leu

Hsuan-Jui Chang

Wen-Jong Wu

Ray-I Chang

Jing-Fa Tsai

Chao-Nan Wang

A method of utilizing an audio signal to transmit data for conducting electronic transactions includes in a user device, converting user identification data into a first audio signal and transmitting the first audio signal to a base device; in the base device, converting the first audio signal into the user identification data; in the base device, transmitting the user identification data and transaction content to a server device; and in the server device, obtaining authorization of a validation entity by utilizing the user identification data and the transaction content, for obtaining a transaction number and transmitting the transaction number to the base device.

User device, base device and system utilizing audio signal to transmit data, and method thereof

The invention discloses a method for transmitting digital contents between devices. First digital contents are modulated into an audio signal in a first device, wherein the first digital contents include contact information and at least one index of at least one second digital content. The audio signal is outputted by at least one audio generator of the first device and then received by at least one audio receiver of a second device. The audio signal is demodulated in the second device to make the second device obtain the first digital contents. The second device obtains the at least one second digital content according to the at least one index of the at least one second digital contents through a wired or wireless communication.

Method and apparatus for transmitting digital contents

A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Semiconductor chip package with cooling arrangement

A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Method and device for making a metal bump with an increased height

Growing community of inventors

Taipei, Taiwan

Fu-Yu Huang