Mediatek Corporation

Fu-Yi Han

Nan-Cheng Chen

Che-Ya Chou

Wen-Chou Wu

Hsing-Chih Liu

Che-Hung Kuo

Min-Chen Lin

Jhe-Jia Kuo

One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

Semiconductor package having discrete antenna device

A power management device includes a first power unit, a second power unit, and a control unit. The first power unit receives a first control signal of a first phase to generate a first current of the first phase flowing to an output node. The second power unit receives a second control signal of a second phase to generate a second current of the second phase flowing to the output node. A phase delay is the difference between the first phase and the second phase. The control unit receives a clock signal in a clock frequency to generate the first control signal and the second control signal. The control unit controls the phase delay to cancel a corresponding harmonic of the clock frequency at the output node.

Devices and methods of cancelling the switching noise from power management integrated circuits

Growing community of inventors

Taichung, Taiwan

Fu-Yi Han