Hon Hai Precision Industry Co., Ltd.

Fu-Yen Tseng

Shin-Wen Chen

Wen-Chang Chen

Yung-Chou Chen

Su-Jen Cheng

Ssu-Han Huang

Fu-Chieh Chan

Chun-Fang Cheng

He-Ming Wu

Chia-Wen Liao

Chi-Jen Chen

A circuit board assembly () includes a circuit board () and at least one electrical element (). The circuit board includes a dielectric substrate () including a supporting surface (), and at least one connecting part () formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media (). At least one air-exhaust hole () extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

Circuit board assembly

A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Camera module with circuit board

An image sensor package is provided. The image sensor package includes a basic body, an image sensor chip, a carrier, and at least one passive component. The image sensor chip is electrically and structurally connected to the basic body, the image sensor package including a sensitive region. The carrier positioned on a supporting portion of the image sensor package spacially surrounding the sensitive region of the image sensor chip. The at least one passive component carried by the carrier and electrically connected to the basic body.

Image sensor package and image capture device with same

A camera module () includes a lens module and a base () with a sensor installed thereon. The base is provided with at least two supporting protrusions () extending therefrom. Each protrusion is oriented the lens module, and the lens module is fixedly to and contacts with the at least two supporting protrusions. A colloid layer surrounding the sensor is sandwiched between the second end of the holder and the base. Electronic components are disposed on the circuit board and covered by the colloid layer.

Camera module having colloid layer surrounding sensor

An electrical connector for electrical connecting a camera module with a circuit board includes an insulative casing and a number of signal terminals. The insulative casing includes a bottom wall and a number of side walls. A receiving space is defined between the bottom wall and side walls for receiving the camera module. The bottom wall defines a receiving opening thereon. The signal terminals are fixed on the side walls and extending beyond the bottom wall configured for electrically connecting with the camera module and the circuit board. The present invention also relates to a camera device having the same.

Electrical connector and camera device having the same

An electrical socket for electrically connecting with a camera module includes a housing, a grounding spring embedded in the housing, a plurality of terminals received in the housing, and a pair of first shields in collaboration with a pair of second shields for substantially enclosing the housing, and a wire embedded in the housing for electrically connecting one of the first shields and the grounding spring. The grounding spring defines a second contacting portion for providing electrical connection between a corresponding ground pad of the camera module and the first shield via the wire, thereby allowing the grounding spring and the first and second shields to prevent external electromagnetic waves from affecting signals communicated between the camera module to a printed circuit board via the wire.

Growing community of inventors

Taipei Hsien, Taiwan

Fu-Yen Tseng