Taiwan Semiconductor Manufacturing Comp. Ltd.

Fu-Tsai Hou

Liang-Chen Lin

Hsien-Pin Hu

Shih-Kai Lin

Shih-Cheng Chang

Jyun-Lin Wu

Tung-Chin Yeh

Gia-Her Lu

An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors

Methods for forming stacked capacitors with fuse protection

A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace.

Bump-on-trace structures with wide and narrow portions

Growing community of inventors

Hsin-Chu, Taiwan

Fu-Tsai Hou