Macronix International Co., Ltd.

Fu-Nian Liang

Chun-Hsiung Hung

Shang-Chi Yang

Hang-Ting Lue

Ken-Hui Chen

Teng-Hao Yeh

Chia-Jung Chen

Chun-Yu Liao

Jer-Hau Hsu

Yufe-Feng Lin

Yung-Hsu Chen

Systems, devices, methods, and circuits for managing reference currents in semiconductor devices. In one aspect, a semiconductor device includes: a memory cell array configured to store data in sets of memory cells and circuitry coupled to the memory cell array. Each set of one or more sets of memory cells in the memory cell array is associated with a respective reference current, and memory cells in sets associated with different reference currents have different threshold voltage distributions. The circuitry is configured to: determine information associated with a reference current for a set of memory cells in the memory cell array based on a memory address corresponding to the set, generate the reference current based on the information associated with the reference current for the set, and sense one or more memory cells in the set based on the reference current.

Managing reference currents in semiconductor devices

A three dimension memory device, such as an AND-type memory, includes a memory cell tile, multiple source line switches, multiple first bit line switches to fourth bit line switches. The memory cell tile is divided into a first and a second memory cell sub-tiles. The first bit line switches are respectively coupled to multiple first bit lines of a first part of the first memory cell sub-tile. The second bit line switches are respectively coupled to multiple second bit lines of a second part of the first memory cell sub-tile. The third bit line switches are respectively coupled to multiple third bit lines of a first part of the second memory cell sub-tile. The fourth bit line switches are respectively coupled to multiple fourth bit lines of a second part of the second memory cell sub-tile.

Three dimension memory device capable of improving sensing accuracy in high-speed data sensing operation

A memory circuit with relatively high reading speed and relatively low switching noise is provided. The memory circuit includes an output buffer device having a first input receiving a data signal having a first voltage level, a second input receiving a pre-set voltage having a second voltage level and an output outputting the data signal, and a pre-set circuit constructed by a pair of MOSFETs and providing the pre-set voltage to the second input before the output buffer device receives the data signal. The pre-set circuit receives a control signal activating the pair of MOSFETs at the same time, and when the output buffer device receives the data signal, a voltage level of the second input is swung from the second level to the first voltage level.

Memory circuit with high reading speed and low switching noise

A memory is provided. The memory includes a memory cell, a clamp transistor, an inverter, a bit line, a pre-charge path and a detector and controller circuit. The memory is coupled to the clamp transistor. The clamp transistor has a first end, a second end and a control end. The inverter has an input end electrically connected to the second end of the clamp transistor and an output end electrically connected to the control end of the clamp transistor. The bit line is electrically connected to the second end of the clamp transistor and the input end of the inverter and has a bit-line voltage thereon. The pre-charge path is electrically connected to the first end of the clamp transistor through a node having a sensing voltage thereon. The detector and controller circuit is electrically connected to the first end of the clamp transistor and the pre-charge path for detecting the sensing voltage in order to open the pre-charge path to raise the bit-line voltage when the sensing voltage is at a low level and close the pre-charge path when the sensing voltage is at a high level.

Memory, bit-line pre-charge circuit and bit-line pre-charge method

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Lujhou, Taiwan

Fu-Nian Liang