Taiwan Semiconductor Manufacturing Comp. Ltd.

Fu-Cheng Hung

Chih-Hua Chen

Chien-Fa Lee

Feng-Kuang Wu

Chi-Wei Chen

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.

Robot gripper for moving wafer carriers and packing materials and method of operating the same

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.

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Tainan, Taiwan

Fu-Cheng Hung