Alchimer

Commissariat a L'energie Atomique

Alchimer S.a.

Aveni

Frédéric Raynal

José Gonzalez

Arnaud Etcheberry

Michel Herlem

Jérôme Daviot

Hervé Monchoix

Said Zahraoui

Henri Perez

Francis Descours

Saïd Zahraoui

Nadia Frederich

Jose Gonzalez

Julian Gerault

Bruno Morel

The invention relates to a machine () adapted to metallize a cavity of a semi-conductive or conductive substrate such as a structure of the through silicon via type, according to a metallization process comprising the steps consisting of:

Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container () intended to contain an electrolyte (E), a support () arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (), a counter-electrode () arranged in the container (), illumination means () comprising a source () emitting light rays and means () to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply () comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction. The invention also concerns the method to conduct an electrochemical reaction on a surface of a corresponding semiconductor substrate.

Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate

The present invention relates to an electrodeposition composition intended particularly for coating a semiconductor substrate in order to fabricate structures of the 'through via' type for the production of interconnects in integrated circuits. According to the invention, the said solution comprises copper ions in a concentration of between 14 and 120 mM and ethylenediamine, the molar ratio between ethylenediamine and copper being between 1.80 and 2.03 and the pH of the electrodeposition solution being between 6.6 and 7.5. The present invention also relates to the use of the said electrodeposition solution for the deposition of a copper seed layer, and to the method for depositing a copper a seed layer with the aid of the electrodeposition solution according to the invention.

Electrodeposition composition and method for coating a semiconductor substrate using the said composition

The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.

Electroplating method for coating a substrate surface with a metal

The invention relates to novel nanoparticles comprising a metal core containing at least one platinoid or an alloy of a platinoid, a first organic coating formed from molecules attached to the surface of the metal core, and a second organic coating formed from molecules different from the molecules forming the first organic coating, and which are grafted onto molecules of the first organic coating. The invention also relates to the use of the nanoparticles as catalysts. The fields of application include devices for producing electrical energy, in particular in fuel cells, devices for detecting or assaying one or more chemical or biological species, in particular in sensors or multisensors, etc.

Nanoparticles comprising a metal core and an organic double coating useful as catalysts and device containing the nanoparticles

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Paris, France

Frédéric Raynal