Wacker-chemie Gmbh

Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Friedrich Steudten

Franz Koppl

Rudolf Griesshammer

Dirk Flottmann

Matth&auml;us Schantz

Matthaus Schantz

Helmut Lorenz

Franz K&ouml;ppl

A method for conveying silicon fragments has the silicon fragments being conveyed over a conveyor surface, which is made from hyperpure silicon. There is a vibrating conveyor, and during the conveying, the sharp edges of the silicon fragments are rounded and mechanical-physical decontamination takes place. The vibrating conveyor has a conveyor surface which is made from hyperpure silicon. A second vibrating conveyor unit has a conveyor surface which is made from hyperpure silicon and has passage openings therethrough.

Vibrating conveyor and method for conveying silicon fragments

A method for the treatment of semiconductor material in a liquid bath has the treatment based upon the occurrence of cavitation being brought about in the liquid bath. The semiconductor material is contacted with a cavitating liquid in order to clean fragments of the semiconductor material and to round fracture edges of the fragments.

Method for the treatment of semiconductor material

The chlorosilanes contained in the residual gases obtained in the deposit of silicon and in the conversion of silicon tetrachloride are first condensed out in liquid form. The hydrogen chloride present in the residual gases is dissolved in the condensed silicon tetrachloride. The remaining, virtually pure hydrogen is passed back into the process. During the distillation of the condensate, the dissolved hydrogen chloride is removed and can be separated off and reused. The trichlorosilane obtained after the distillation and the silicon tetrachloride can also be reused in the deposition process or the conversion process, respectively.

Process for working up the residual gases obtained in the deposition of

The invention provides a process and an apparatus for machining silicon r and tubes by abrasion. The risk of fracture of such workpieces during grinding is prevented in this method and apparatus by the workpiece being held vertically in a cylindrical grinding machine in which the individual tools are uniformly arranged around the circumference of the workpiece in such a manner that their contact pressures are mutually substantially compensated.

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Burghausen, Germany

Friedrich Steudten