Ev Group E. Thallner Gmbh

Ev Group Gmbh

Friedrich Paul Lindner

Markus Wimplinger

Thomas Plach

Thomas Wagenleitner

Florian Kurz

Jurgen Burggraf

Thomas Glinsner

Erich Thallner

Jürgen Burggraf

Daniel Burgstaller

Stefan Pargfrieder

Gerald Kreindl

Dominik Zinner

Gerald Mittendorfer

Peter Fischer

Christian Schon

Harald Zaglmayr

Ronald Holzleitner

Peter Oliver Hangweier

Peter-Oliver Hangweier

Matt Crowder

Evelyn Reisinger

Othmar Luksch

Peter Starzengruber

Christian Schön

A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.

Method for producing singulated encapsulated components

The invention relates to a device and a method for the alignment of substrates.

Device and method for the alignment of substrates

A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.

Method for prefixing of substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Device and method for bonding substrates

An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.

Device and method for embossing micro- and/or nanostructures

A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.

Method and device for bonding substrates

The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.

Receptacle device, device and method for handling substrate stacks

Device for prefixing of substrates

Growing community of inventors

Scharding, Austria

Friedrich Paul Lindner