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Universitãt Stuttgart

Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.v.

Universitaet Stuttgart Institut Fur Strahlwerkzeuge

Friedrich Dausinger

Werner H Muller

Hans Opower

Adolf Giesen

Helmut Huegel

Juergen Griebsch

Eckart Von Roda

Otto Baumann

Wilbert Reibetanz

Ruediger Hack

Peter Arnold

The penetration depth of a machining laser beam into workpiece is continuously monitored in that a measuring laser beam is directed onto the vapor capillary that is generated in the workpiece by the machining laser beam. The portion of the measuring laser beam that re-emerges from the vapor capillary is monitored by a sensor whose output signal is then used to bring about (producing holes) or to adjust (welding or superficial re-melting of a workpiece) the desired penetration depth defined by a pre-selected reference signal

Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process

In order to improve a semiconductor laser system with a plurality of semiconductor laser units comprising a laser oscillator, laser radiation exiting from each of these units, a light-conducting fiber associated with each semiconductor laser unit, a coupling element for coupling the laser radiation exiting from the respective semiconductor laser unit into the respective light-conducting fiber, and a fiber bundle comprising the fibers as light conductor system, a total laser radiation formed by the sum of the coherent laser radiation generated by the respective semiconductor laser units exiting from one end of the fiber bundle, this total laser radiation illuminating a target surface on an object to be irradiated during laser activity of all the semiconductor laser units, such that complex irradiation tasks can be performed with this system in a simple and as effective a manner as possible it is suggested that a control be provided for controlling the power of each individual semiconductor laser unit in a defined manner, and that an irradiation of different surface elements of the target surface with an intensity individually definable for each surface element be specifiable to the control.

Power-controlled, fractal laser system

To apply hard cutting particles, for example of tungsten carbide, on the surface of the cutting edge of a cutting tool, such as a saw blade, a drill, or the like, the cutting edge is partially melted by an energy beam, for example a laser beam, or an electron beam. A laser beam is preferred since, then, the process can be carried out in air, or in a protective gas atmosphere, rather than in a vacuum. The beam partially melts the cutting edge and the granules of the hard metal particles, preferably in a random grain size of between 0.3 to 1.5 mm is permitted to run down, over the partially melted surface, excess being collected for reuse; alternatively, the partially melted surface can be dipped into the granules, and permitted to solidify.

Method of embedding hard cutting particles in a surface of a cutting

Directing a laser beam at a surface to be treated, such as a metallic surface which is likely to reflect much of the energy, results in a high proportion of absorbed energy if the laser beam has an oblique incidence, particularly if the laser beam is polarized in a direction parallel to the plane of incidence (defined as the plane which contains the axis of the laser beam and the perpendicular to the surface at the center of the spot of incidence). In the case of iron and steel surfaces the absorbtion is markedly increased at angles of incidence greater than 45.degree. and just short of glancing incidence, with a maximum near 80.degree..

Laser beam surface treatment process for materials of large reflectivity

Growing community of inventors

Stuttgart, Germany

Friedrich Dausinger