Robert Boschgmbh

Frieder Sundermeier

Frank Fischer

Lars Metzger

Matthias Fuertsch

Andreas Arlt

Christoph Schelling

Heribert Weber

Stefan Pinter

Harry Kaiser

Johanna May

Ulrich Schaaf

Ruben Wahl

Jana Hoffmann

A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed.

Circuit carrier and method for producing a circuit carrier

A pressure sensor for detecting a pressure of a medium, in particular for a braking apparatus, includes a connecting flange having a fluid channel for connection to the medium which is to be measured, a pressure measuring cell which is arranged at the end of the fluid channel, and a circuit mount, with the pressure measuring cell having a contact surface for making contact. The contact surface is arranged at an angle relative to a center axis of the pressure sensor.

Pressure sensor, in particular for a braking apparatus

A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.

Micromechanical structural element having a diaphragm and method for producing such a structural element

In a mass flow sensor having a layered structure on the upper side of a silicon substrate (), and having at least one heating element () patterned out of a conductive layer in the layered structure, thermal insulation between the heating element () and the silicon substrate () is achieved by way of a silicon dioxide block () which is produced beneath the heating element () either in the layered structure on the silicon substrate () or in the upper side of the silicon substrate (). As a result, the sensor can be manufactured by surface micromechanics, i.e. without wafer back-side processes.

Micromechanical mass flow sensor and method for the production thereof

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Kornwestheim, Germany

Frieder Sundermeier