Robert Boschgmbh

Frieder Haag

Kurt Weiblen

Stefan Pinter

Mathias Bruendel

Hubert Benzel

Ulrike Scholz

Anton Doering

Ricardo Ehrenpfordt

Jochen Rupp

Christian Ohl

Juergen Kurle

Matthias Illing

Torsten Kramer

Stefan Mueller

Matthias Boehringer

Juergen Nieder

Markus Lutz

Heribert Weber

Frank Fischer

Simon Armbruster

Jens Frey

Axel Franke

Ronny Ludwig

Tjalf Pirk

Eckhard Graf

Frank Reichenbach

Oliver Kohn

Arnim Hoechst

Florian Grabmaier

Michael Knauss

Eckart Schellkes

Eric Ochs

Ralf Hausner

Stefan Finkbeiner

Sonja Knies

Hans-Peter Baer

Juergen Butz

Lutz Rauscher

Martin Holzmann

Christoph Gahn

Michael Honer

Rolf Speicher

Ingbert Gerngross

Juergen Fritz

Simon Ambruster

Thomas-Achim Boes

Combined display and operating device

Remote for a display and operating device

Bicycle stem

Remote controller for an operating device with display

Operating device with display

A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.

Micromechanical sensor system and corresponding manufacturing method

A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Method for constructing an electrical circuit, and electrical circuit

A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

Method for producing a two-chip assembly and corresponding two-chip assembly

Growing community of inventors

Wannweil, Germany

Frieder Haag