Institut Vedecom

Elvia Pcb

Valeo Systemes Thermiques

Friedbald Kiel

Gilles Elliot

Vincent Feuillard

Xavier Goumain

Olivier Belnoue

Karen Chauvin

The electronic card with printed circuit () comprises at least one antenna with slots (AT) including a cavity () and a metal conductive layer () covering the cavity and having a plurality of slots (S). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer () on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.

Electronic card with printed circuit comprising an antenna with integrated slots and method for the production thereof

The invention relates to a modular element () comprising a stratification of first and second electroconductive plates (PH, PB) which are separated by an intermediate dielectric layer (CD) and at least one electronic power switching chip (CP, CP) which is implanted between the first and second plates, the chip having a upper face comprising a first power electrode and a switching control electrode and a lower face comprising a second power electrode, and the first and second power electrodes being in electrical continuity respectively with the first and second plates. According to the invention, the modular element comprises a plurality of openings (OG, OA, OB, OC, OD) extending into the stratification from outer surfaces of the first and second plates and perpendicularly to said outer surfaces, the plurality of openings comprising at least one first opening (OG) communicating with the switching control electrode and at least one second opening (OA, OB) passing through the entire stratification, the first and second openings each comprising a dielectric layer (DE) and an electroconductive layer (CI), and the electroconductive layer of the first opening being electrically connected to the switching control electrode.

Power switching modular element and dismountable assembly of a plurality of modular elements

The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (Sto S) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (Bto B) and at least one internal portion of bus bar (Bto B, Bto B) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as 'press pack'.

Assembly of bus bars forming a casing and heat dissipator for an electronic power device

The power module comprises an electronic board (EB), in which at least one power switching branch is integrated, a capacitor (C) and at least three DC power supply busbars (B, B, B), wherein the electronic board is mounted between a first busbar (B) and a second busbar (B) and the capacitor is mounted between the second busbar (B) and a third busbar (B) and the electronic board, the capacitor and the busbars comprise electric contact faces allowing assembly, of the 'press pack' type, of the electronic board and of the capacitor.

Power switching module and electronic power device integrating said module

The method comprises the steps of 1) producing first and second blanks (EB, EB) by laminating insulating and conductive inner layers (PP, CP, E) on copper plates forming a base (MB, MB), at least one electronic chip (MT, MD) being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

Method for integrating power chips and power electronics modules

The electronic card with printed circuit comprises at least one diffraction structure (DS) having a cavity () and a diffraction plate (). In accordance with the invention, the diffraction structure is incorporated in the thickness of the electronic card with printed circuit, the cavity being formed, by removal of material, in the thickness of the electronic card with printed circuit and the diffraction plate being formed in a plate which is arranged on the electronic card with printed circuit and closes the cavity.

Electronic card with printed circuit comprising an integrated diffraction structure and method for the production thereof

The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BB, BB) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB, BB, BB, BB; BB, BB, BB) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (ME, ME).

Electronic power circuits comprising bus-bars forming heat sinks and integration method

The method for producing a preform integrating at least one electronic chip included between insulating and/or conductive laminated internal layers; mechanically securing metal bus-bar segments at given spaced-apart positions on opposing upper and lower faces of the preform, using dielectric portions of a resin prepreg; and for each of the upper and lower opposing faces, electrodepositing a metal layer in order to interconnect bus-bar segments secured to the face in question and an electrode of the electronic chip, thereby forming an electronic power circuit comprising bus-bars forming heat sinks.

Method for the integration of power chips and bus-bars forming heat sinks

The method comprises the steps of 1) producing first and second blanks (EB) including reserved-space defining means (HM, HM), by laminating insulating and conductive inner layers (PP, CP) on copper plates forming a base (MB), at least one electronic chip being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.

Parallelisable method for integrating power chips and power electronics

The power switching module includes first and second subassemblies that are superimposed on top of each other to form a stack and that comprise first and second electronic power switches forming a bridging arm, respectively. The module comprises a metal central sheet (LW) and first and second metal end sheets (LW, LW) forming top and bottom ends of the stack. According to the invention, the module also comprises first, second and third metal terminal rods () that extend through the stack and open onto at least one of the top and bottom ends thereof, the first, second and third rods being in electrical continuity with the first and second metal end sheets and the metal central sheet, respectively.

Growing community of inventors

Fontainebleau, France

Friedbald Kiel