Micron Technology Incorporated

Fredrick David Fishburn

Sanh D Tang

Martin Ceredig Roberts

Srinivas Pulugurtha

Michel Koopmans

Kuo-Chen Wang

Diem Thy N Tran

Hideki Gomi

Eiji Hasunuma

Haitao Liu

Charles L Ingalls

Si-Woo Lee

Scott L Light

Makoto Morino

Song Guo

Soichi Sugiura

Mark A Zaleski

Atsuko Otsuka

Oscar O Enomoto

Ichiro Abe

Yoshiyuki Nanjo

Keisuke Hirofuji

Some embodiments include an assembly having a stack of first and second alternating levels. The first levels are insulative levels. The second levels are device levels having integrated devices. Each of the integrated devices has a transistor coupled with an associated capacitor, and the capacitor is horizontally offset from the transistor. The transistors have semiconductor channel material, and have transistor gates along the semiconductor channel material. Each of the transistors has a first source/drain region along one side of the semiconductor channel material and coupled with the associated capacitor, and has a second source/drain region. Wordlines extend horizontally along the device levels and are coupled with the transistor gates. Digit lines extend vertically through the device levels and are coupled with the second source/drain regions. Some embodiments include methods of forming integrated structures.

Devices having a transistor and a capacitor along a common horizontal level, and methods of forming devices

A microelectronic device comprises a semiconductive pillar structure comprising a central portion, a first end portion, and a second end portion on a side of the central portion opposite the first end portion, the first end portion oriented at an angle with respect to the central portion and extending substantially parallel to the second end portion, a digit line contact on the central portion of the semiconductive pillar structure, a first storage node contact on the first end portion, and a second storage node contact on the second end portion. Related microelectronic devices, electronic systems, and methods are also described.

Microelectronic devices including semiconductive pillar structures, and related electronic systems

Some embodiments include an assembly having active material structures arranged in an array having rows and columns. Each of the active material structures has a first side which includes a bit contact region, and has a second side which includes a cell contact region. Each of the bit contact regions is coupled with a first redistribution pad. Each of the cell contact regions is coupled with a second redistribution pad. The first redistribution pads are coupled with bitlines, and the second redistribution pads are coupled with programmable devices. Some embodiments include methods of forming memory arrays.

Memory arrays, and methods of forming memory arrays

A semiconductor device comprises a memory storage component and a transistor in operable communication with the memory storage element. The transistor comprises a source region, a drain region, a gate electrode between the source region and the drain region, a charge trapping material surrounding at least an upper portion of the gate electrode, and an oxide material on sides of the charge trapping material. Related systems and methods are also disclosed.

Semiconductor devices including transistors comprising a charge trapping material, and related systems and methods

Systems and methods using a three-dimensional memory device with a number of memory cells disposed vertically in a number of pillars arranged along a horizontal direction can be used in a variety of applications. In various embodiments, pillars of memory cells may be disposed between lower and upper digitlines respectively coupled to different sense amplifiers to provide read/write operations and refresh operations. In various embodiments, a three-dimensional memory device having an array of memory cells vertically arranged in pillars may include a sense amplifier and digitline with a static random access memory cache, where the static random access memory cache is disposed below the array of memory cells in the same die. Additional apparatus, systems, and methods are disclosed.

Three dimensional memory devices

Memory arrays

Growing community of inventors

Hiroshima, Japan

Fredrick David Fishburn