Applied Materials, Inc.

Frederik W Freerks

Lloyd M Berken

Hatice Sahin

William H Jarvi

Michael Robert Rice

Jeffrey C Hudgens

Tetsuya Ishikawa

Mohsen Salek

John Stanley Booth

Richard Giljum

Tim Leong

Kenneth D Ames

Lance S Reinke

James R Ciulik

M Uenia Crithfield

Al DiFrancesco

David Schott

Michael Holtzman

Timothy Y Wang

William Reams

The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.

Robot blade for semiconductor processing equipment

A vacuum processing system may have a two-piece slit valve door, including a seal plate mounted on a mounting member, for closing the slit valve in a vacuum chamber. The seal plate, the piece that actually contacts the slit valve, may have a molded-in-place seal for making the contact and preventing metal-to-metal contact between the door and the valve. The seal may have a parabolic profile and be adhesively bonded within a groove in order to enhance its compressive and sealing capabilities. The seal plate may be removable for ease of service or replacement. Any particles generated by metal-to-metal contact between the seal plate and its mounting member may be captured by an O-ring statically sealed around the periphery between the two pieces.

Two-piece slit valve door with molded-in-place seal for a vacuum

A wafer position error detection and correction system determines the presence of a wafer on a wafer transport robot blade. The system also determines a wafer position error by monitoring the position of the wafer with respect to the blade with one sensor which is located proximate to each entrance of a process chamber. When a wafer position error is detected, the system determines the extent of the misalignment and corrects such misalignment if correctable by the wafer transport robot or alerts an operator for operator intervention. The system incorporates a transparent cover on the surface of the wafer handling chamber and four optical detection sensors disposed on the surface of the transparent cover, in which each sensor is placed proximate to the entrance of the process chamber. In addition, an I/O sensor is placed adjacent the I/O slit valve to detect and correct wafer position errors. The detection sensors direct light through the wafer handling chamber to reflectors on the floor of the transfer chamber which reflect the light back to the detector sensors. A detector within the detector sensor detects when the beam path from the position sensor to the reflector is uninterrupted. As a wafer is retracted out of a process chamber or a wafer cassette, the position of the wafer with respect to the blade is measured, thus determining whether the wafer is properly placed on the wafer.

Wafer position error detection and correction system

A wafer positioning system determines the position of a wafer during processing by monitoring the position of the wafer transport robot as the robot transports the wafer by one or more position sensors. The wafer positioning system incorporates a transparent cover on the surface of the wafer handling chamber and two optical position sensors disposed on the surface of the transparent cover. The position sensors direct light through the wafer handling chamber to reflectors near the floor of the chamber which reflect the light back to the position sensors. A detector within the position sensor detects when the beam path from the position sensor to the reflector is uninterrupted. As wafers are transported through the chamber, the edge of the transported wafer interrupts the position sensor beam path causing the output of the position sensor to switch states. When the position sensor output switches, the position of the wafer transport robot is measured. At least two data points are measured to establish the wafer position. If the wafer is not at its nominal position, the position of the wafer transport robot is adjusted to compensate for the wafer misalignment.

Wafer positioning system

A cassette loading mechanism for semiconductor processing equipment reduces the possibility of repetitive stress injury that may occur as a result of repeatedly loading and unloading a cassette of substrates by eliminating manual cassette rotation. The loader receives a cassette and, by compound translational movement, rotates the cassette about 90.degree. from a horizontal loading position, in which the substrates contained therein are positioned in a vertical orientation, to a position in which the substrates contained therein are positioned in a horizontal orientation, such that the cassette is aligned to the other components of the substrate handling system for substrate transfer. The cassette motions are interlocked with the cassette clamping mechanism and the cassette loader door and a cassette shuttle by pneumatic or electronic logic.

Cassette loader having compound translational motion

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Cupertino, CA, United States of America

Frederik W Freerks