Robert Boschgmbh

Frederik Schrey

Richard Fix

Alexander Martin

Oliver Wolst

Achim Trautmann

Joachim Rudhard

Mike Kunze

Ingo Daumiller

Martin Le-Huu

A semiconductor device having a substrate, and at least one contact, situated on and/or above a surface of the substrate, having at least one layer made of a conductive material, the conductive material including at least one metal. The layer made of the conductive material is sputtered on, and has tear-off marks on at least one outer side area between an outer base area facing the surface and an outer contact area facing away from the surface. A manufacturing method for a semiconductor device having at least one contact is also described.

Semiconductor device having at least one contact, and manufacturing method for a semiconductor device having at least one contact

An electronic component includes a printed conductor structure on a substrate, as well as a film which contacts the printed conductor structure. The film has a smaller layer thickness than the printed conductor. The printed conductor structure has a region which is covered by the film for the purpose of contacting.

Electronic component

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Leonberg, Germany

Frederik Schrey