Robert Boschgmbh

Max-planck-gesellschaft Zur Forderung Der Wissenschaften E.v.

Novaled Gmbh

Frederik Ante

Christoph Schelling

Mirko Hattass

Reinhard Neul

Ricardo Ehrenpfordt

Torsten Ohms

Tjalf Pirk

Jochen Zoellin

Remigius Has

Sascha Dorok

Friedjof Heuck

Jan Blochwitz-Nimoth

Johannes Kenntner

Stefan Spiessberger

Florian Grabmaier

Michael Curcic

Mathias Bruendel

Holger Hoefer

Juergen Graf

Tobias Canzler

Daniel Pantel

Sebastian Schuler-Watkins

Timo Lindemann

Klaus Offterdinger

Cristian Nagel

Maximilian Amberger

Viktor Morosow

Mazyar Sabbar

Holger Rank

Hagen Klauk

A coaxial LiDAR system having a reduced adjustment complexity and reduced installation space includes a transmitter unit designed to emit LiDAR radiation, a receiver unit designed to detect incident LiDAR radiation, and an optical system for imaging LiDAR radiation, the radiation emitted by the transmitter unit and the radiation from the optical system incident upon the receiver unit being transmitted in collinear form, the emitting surface of the transmitter unit being situated outside of the focus of the imaging optical system.

Coaxial LiDAR system

A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.

Micromechanical sensor device with integrated housing seal, micromechanical sensor assembly, and corresponding manufacturing method

A sensor system includes a sensor device and a cover device. The sensor device includes an external surface on which at least one electrical test contact is arranged. The cover device includes at least partially an electrically insulating material and is mechanically connected to the sensor device. The cover device is configured to cover the at least one electrical test contact of the sensor device so as to prevent contact from being made to the at least one electrical test contact from outside the sensor system.

Sensor system and cover device for a sensor system

A sensor comprises a sensor element configured to provide a sensor signal representing at least one measurand detected by the sensor element, an electrical circuit configured to process the sensor signal to form a data signal, a photovoltaic cell configured to provide electrical energy for the sensor element and the electrical circuit, and a housing, in which the sensor element, the electrical circuit and the photovoltaic cell are positioned, the housing including a recess in which the photovoltaic cell is positioned, and a rim surrounding the recess and protruding beyond the photovoltaic cell. A method is also provided.

Sensor and method for producing a sensor

A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.

Microelectronic component arrangement and production method for a microelectronic component arrangement

A photovoltaic module has at least one solar cell having an irradiation surface for receiving light. The photovoltaic module is configured to provide a voltage. The photovoltaic module also includes a carrier unit which is arranged laterally offset from the solar cell at least on one side. A first surface of the carrier unit is oriented flush with the irradiation surface of the solar cell within a predefined tolerance range. The photovoltaic module also includes at least one electrical conductor, which contacts a carrier contact connection on a second surface of the carrier unit opposite the first surface via a cell contact connection of an electronic component on the solar cell or the solar cell in an electrically conductive manner. The cell contact connection is arranged on a contacting side of the solar cell opposite the irradiation surface.

Photovoltaic module and method for producing a photovoltaic module

An acceleration sensor includes a circuit board with a recess that exposes a spring structure. The spring structure is formed from a material of the circuit board exposed by the recess and includes a vibrating element that is held in a resilient manner via at least one spring element. The sensor further includes a reference element connected rigidly to the circuit board and arranged at a distance from and opposite the vibrating element, an electrical circuit arranged on the vibrating element at a distance from the reference element, and at least one detection element. The circuit is configured to evaluate a signal that is configured to be influenced by a change in distance between the reference element and the at least one detection element in order to sense an acceleration of the acceleration sensor.

Acceleration sensor and method for producing an acceleration sensor

Measures are described which simplify the functional testing of a component having an MEMS element provided with a pressure-sensitive sensor diaphragm, and which allow a self-calibration of the component even after it is already in place, i.e., following the end of the production process. The component has a housing, in which are situated at least one MEMS element having a pressure-sensitive sensor diaphragm and a switching arrangement for detecting the diaphragm deflections as measuring signals; an arrangement for analyzing the measuring signals; and an arrangement for the defined excitation of the sensor diaphragm. The housing has at least one pressure connection port. The arrangement for exciting the sensor diaphragm includes at least one selectively actuable actuator component for generating defined pressure pulses that act on the sensor diaphragm.

Component part and method for testing such a component part

A new signal acquisition concept is provided for MEMS components having a pressure-sensitive diaphragm element, which at least partially spans a pressure connection opening. This signal acquisition concept is distinguished by an especially high sensitivity. For this purpose, the MEMS component includes a resonant vibrator device having a vibrating element, which is suspended, capable of vibrating, within a closed cavity and is equipped with at least one drive electrode and at least one sensing electrode. The vibrating element of the resonant vibrator device is coupled mechanically to the diaphragm element, so that the vibrating element is deformed in the case of a diaphragm deflection.

MEMS component

A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.

Component and method for producing same

A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element.

Component having a micromechanical microphone structure

An electrical circuit includes a solar cell that has a photovoltaically active front side and a back side. An electronic or micromechanical component is arranged on the back side of the solar cell and is electrically connected to the photovoltaically active front side of the solar cell by a contact-making structure. The electrical circuit also includes a transparent first protective layer that is arranged on the photovoltaically active front side of the solar cell. The contact-making structure has a first contact-making section that is arranged on a front side of the first protective layer facing away from the solar cell.

Electrical circuit and method for producing an electrical circuit

A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor system, and (iii) a stationary acoustically penetrable counterelement having through holes, which counterelement is situated in the layer construction over the diaphragm and functions as the carrier for at least one immovable electrode of the microphone capacitor system. The diaphragm is tied in to the semiconductor substrate in a middle area, and the diaphragm has a corrugated sheet metal type of corrugation, at least in regions.

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Stuttgart, Germany

Frederik Ante