International Business Machines Corporation

Frederick William Kern, Jr

William Alfred Syverson

Glenn Walton Gale

Donald Joseph Martin

Harald F Okorn-Schmidt

Russell Herbert Arndt

Ryan Wayne Wuthrich

Karen P Madden

George Francis Ouimet, Jr

John Joseph Snyder

Richard Hilliard Gaylord, Iii

Dario Salgado

Madhav Datta

Kenneth T Settlemyer, Jr

Thomas E Dinan

Joel M Sharrow

William E Corbin, Jr

Jeffrey Alan Brigante

Ben Kim

Maurice R Hevey

Contaminants are removed from a surface of a substrate by applying a fluid to the surface; lowering the temperature of the fluid to form a solid layer of the fluid and entrap contaminants therein; and applying energy to the layer and/or substrate to cause the layer containing the contaminants to separate from the surface.

Method of cleaning contaminants from the surface of a substrate

An apparatus for drying one or more workpieces. The apparatus includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rinse liquid so that the liquid and any contaminants contained therein are removed from the water surface.

Apparatus for removing contaminants from a workpiece using a chemically reactive additive

Disclosed is a method of removing liquid from a surface of a semiconductor wafer that comprises the steps of providing a plurality of capillary channels, each said capillary channel having a first opening and a second opening, and then placing said first openings in contact with the liquid in a manner effective in drawing away the liquid by capillary action.

Capillary dry process and apparatus

A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.

Method and apparatus for combined particle location and removal

A method for drying one or more workpieces. The method includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rise liquid so that the liquid and any contaminants contained therein are removed from the wafer surface.

Method for removing contaminants from a workpiece using a chemically reactive additive

Semiconductor substrates are contacted with a deionized water solution containing an acidic material.

Process for treating a semiconductor substrate

The present invention is a method and apparatus for mechanically bonding a polymer to a convex surface of a substrate to provide intimate contact therebetween for improved energy transport between a transducer on one side of the substrate and a chemical bath on the other. The polymer seals the surface of the substrate from the chemical bath and may have a low adhesion to the substrate. A thin film of the polymer is brought under a tensile stress to provide intimate physical contact with most of the area of the convex surface. In one embodiment, the tensile stress is achieved by providing polymer as a liquid on the convex surface and then cooling to take advantage of differential thermal contraction between the polymer and the substrate to achieve the tensile stress in the polymer.

Polymer protected component

A method for reducing the corrosive chemical vapor permeability of a polyfluoroorgano resin substrate which comprises coating its outer surface with a vinylidene dichloride copolymer. The method produces a polyfluoroorgano resin substrate-vinylidene dichloride copolymer composite, for example a TEFLON-perfluoralkyl vinylether copolymer pipe having its surface immediate to the environment treated with a vinylidene dichloride/vinyl chloride copolymer.

Method of making polyfluoroorgano composites

A fluid mixing system and a method of using same for maintaining uniform concentrations of fluid chemical additives in a dilutant, in which the system includes a multi-port aspirator device including a venturi having a venturi inlet for receiving dilutant and a venturi outlet of reduced diameter for discharging said dilutant, a dilutant injector source fluidly coupled to said multi-port aspirator device for delivering a dilutant at a dilutant pressure thereto, and a plurality of injectate sources fluidly connected to the aspirator device at or immediately downstream said venturi outlet, wherein each said injectate source is capable of independently varying pressure at said a multi-port venturi injector with respect to said dilutant pressure. The use of the inventive fluid mixing system also provides a facile and accurate means of injecting required volumes of wet chemicals into a flowing stream of a carrier fluid.

Integrated dynamic fluid mixing apparatus and method

A method for reducing the chemical vapor permeability of a polyfluoroorgano resin substrate by coating its surface with a vinylidene dichloride copolymer is disclosed. The method produces a polyfluoroorgano resin substrate-vinylidene dichloride copolymer composite, for example a Teflon PFA pipe having its surface immediate to the environment treated with a vinylidene dichloride/vinyl chloride copolymer.

Polyfluoroorgano composites and method for making

Disclosed is an electrochemical etching apparatus including a fixture for holding a workpiece; a nozzle, positioned opposite the fixture and facing the workpiece, for impinging an etchant onto the workpiece; and an electrode for applying a voltage between the electrode and the workpiece; wherein, in operation, one of the fixture and nozzle are rotated and the nozzle is moved radially outwardly so that the workpiece is spirally etched. Also disclosed is a method of spirally etching a workpiece.

Growing community of inventors

Colchester, VT, United States of America

Frederick William Kern, Jr