Kollmorgen Corporation

Photocircuits Corporation

Photocircuits Division of Kollmorgan Corporation

Frederick W Schneble, Jr

Edward J Leech

Joseph Polichette

Rudolph J Zeblisky

John F McCormack

The present invention relates to a novel immersion tin bath composition and a novel and improved method of depositing a smooth, even, metallic tin coating over metallic surfaces, providing improved solderability.

Process of tin plating by immersion

Electroless metal deposition solutions are provided which comprise, in combination, an ion of a metal whose electroless metal deposition is desired; a complexing agent for said ion; a reducing agent for said ion; a pH regulator; and less than about 25 parts per million of metal ions which have an oxidation potential greater than the oxidation potential of the ion of the metal whose electroless deposition is desired.

Improvements in electroless metal plating

There is provided a process for producing resin rich surfaces of desired and specified thickness and physical, chemical, electrical and/or optical properties involving the use of a transfer base material to move a viscous, liquid, hardenable composition after partial hardening into a non-tacky state into contact with the surface of a second, permanent base, completing the hardening of the composition into a resin-rich surface layer adhering to the second base and subsequently removing the transfer base therefrom. In specific embodiments, the permanent base itself can be hardenable and complete hardening is effected simultaneously; the surface layer can be an adhesive layer; and the surface layer can be catalytic throughout to electroless metal deposition.

Growing community of inventors

Oyster Bay, NY, United States of America

Frederick W Schneble, Jr