Intel Corporation

Ptt Public Company Limited

Frederick W Atadana

Taylor W Gaines

Elah Bozorg-Grayeli

Wei Ey Li

Edvin Cetegen

Sergio Antonio Chan Arguedas

Kyle Jordan Arrington

Goran Jovanovic

Ken P Hackenberg

Tony Dambrauskas

Hsin-Yu Li

Robert F Cheney

Minseok Ha

Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Integrated circuit package lids with polymer features

Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

Underfill flow management in electronic assemblies

An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

IC assemblies including die perimeter frames suitable for containing thermal interface materials

Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

Microelectronic package with underfilled sealant

Disclosed microscale reactors comprise lamina for carrying out multi-phase reactions for making desired chemical products, such as biohydrogenated diesel (BHD). Microreactor embodiments include a bottom clamp plate, a top clamp plate, and at least one catalyst plate positioned between and operatively associated with the bottom clamp plate and the top clamp plate. Catalyst plates include a catalyst associated for catalyzing the production of product from feedstock. To address the problems encountered when using microchannel reactors, the microscale-based reactors may include a mixer plate assembly and/or at least one catalyst lamina comprising an array of microscale posts. Disclosed microreactor systems for producing BHD include a feedstock source, a hydrogen source and an inert gas source each fluidly coupled to respective microreactor inlets. Certain method embodiments include operating a microreactor or a microreactor system to produce BHD from a suitable feedstock selected from animal fats, vegetable oils, or combinations thereof.

Microscale-based chemical reactor

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Chandler, AZ, United States of America

Frederick W Atadana