Tokyo Electron Limited

Varian Associates, Inc.

Supercritical Systems, Inc.

Frederick Paul Layman

Maximilian Albert Biberger

Thomas Robert Sutton

Phillip M Hobson

Michael J Kuhlman

Paul H Dick

George L Coad

Roger M Vecta

David A Huntley

A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical drive mechanism couples the platen to the chamber housing. In operation, the mechanical drive mechanism separates the platen from the chamber housing for loading of the semiconductor substrate. In further operation, the mechanical drive mechanism causes the second sealing surface of the platen and the first sealing surface of the chamber housing to form a high pressure processing chamber around the semiconductor substrate.

High pressure processing chamber for semiconductor substrate

An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical processing module and the non-supercritical processing module are coupled to the transfer module. The robot is preferably located within the transfer module. In operation, the robot transfers a workpiece from the entrance of the transfer module to the supercritical processing module. After supercritical processing, the robot then transfers workpiece from the supercritical processing module to the non-supercritical processing module. After the non-supercritical processing, the robot returns the workpiece to the entrance of the transfer module. Alternatively, the non-supercritical processing is performed before the supercritical processing.

Method of supercritical processing of a workpiece

Apparatus for supercritical processing of a workpiece

An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Method for supercritical processing of multiple workpieces

Apparatus for supercritical processing of multiple workpieces

Method and apparatus for supercritical processing of multiple workpieces

A valve for a wafer processing machine is formed with a wedge-shaped sliding gate. A folded wafer handling arm is stored within the wedge and pumped to keep the arm clean while the valve is closed.

Valve incorporating wafer handling arm

In order to compensate for worn or distorted wafer cassettes and missing wafers, the cassette of wafers is scanned through a beam. The timing of the interruptions of the beam is used to inventory the wafers present and measure the exact position of each wafer relative to the base of the cassette.

System for measuring the position of a wafer in a cassette

A wafer processing system including wafer handling arms incorporated into vacuum isolation valves is described. A loadlock with elevator and optical sensors is used to inventory and position a cassette of wafers. The wafers in the cassette can be randomly accessed. A computer is used to control the system according to a task status table independent of time sequence.

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Fremont, CA, United States of America

Frederick Paul Layman