Harris Corporation

Frederick P Jones

John M Neilson

Joseph A Yedinak

Victor A Temple

Carl Franklin Wheatley, Jr

Christopher L Rexer

Robert S Wrathall

Paul J Wodarczyk

Jeffrey G Mansmann

Claire E Jackoski

A pattern for a wafer for a MOS-gated semiconductor device includes plural ribbons extending from a source contact region to another source contact region, each of the ribbons having a single source region between two channel regions, so as to increase the device's current-carrying capability per unit area relative to the prior art. The pattern increases the size of the active current-carrying area (the channel and neck regions of the device) relative to the area of the source contact areas. The source contact regions may be discrete or linear, and the ribbons may extend therefrom perpendicularly or at other angles.

Method of forming MOS-gated semiconductor devices having mesh geometry

Mesh geometry for MOS-gated semiconductor devices

In a power FET composed of a substrate having upper and lower surfaces, the FET providing a current flow path between the upper and lower surfaces, and the FET having a plurality of drain regions extending to the substrate upper surface and an insulated gate electrode disposed on the upper surface, the improvement wherein said drain regions are disposed in a hexagonal lattice pattern, and said gate electrode comprises: a plurality of gate segments each covering a respective drain region; and a plurality of connecting segments each connecting together three of said gate segments.

Power FET with gate segments covering drain regions disposed in a

In a power FET composed of a substrate having upper and lower surfaces and having a semiconductor body of a first conductivity type, the body providing a current flow path between the upper and lower surfaces and having at least one body region which extends to said upper surface; and at least one base region extending into the substrate from the upper surface, the base region being of a second conductivity type opposite to the first conductivity type and having an upper portion located adjacent the upper surface of the substrate and a lower portion separated from the upper surface of the substrate by the upper portion, the upper portion defining a channel which is disposed in the current flow path adjacent the upper surface of the substrate, and the FET further having an insulated gate disposed at the upper surface above the body region, an impurity layer region extends into the channel from the upper surface of the substrate for giving the channel a lower impurity density than the lower portion of the base region.

Power FET having reduced threshold voltage

A monolithic semiconductor device comprises a VDMOS transistor having first and second main electrodes and a control electrode, and a lateral MOSFET having first and second main electrodes and a control electrode, wherein one of the first and second electrodes of the lateral MOSFET has a lower doping concentration than that of the first and second main electrodes of the VDMOS transistor for forming a Schottky barrier diode.

Power VDMOSFET with schottky on lightly doped drain of lateral driver FET

A power MOS transistor, including source, drain, and gate electrodes, comprises a substrate of a semiconductor material of one conductivity type having first and second opposed surfaces; a drain region extending through the substrate between the surfaces; a plurality of spaced body regions of the opposite conductivity type extending into the substrate from the first surface; and a source region of the one conductivity type extending into the substrate from the first surface within each of the body regions, the interface of each of the source regions with its respective body region at the first surface being spaced from the interface of its respective body region and the drain region at the first surface to form a channel region therebetween. A gate electrode overlies and is insulated from the first surface and extends across the channel regions. A conductive electrode extends over and is insulated from the gate electrode, and contacts at least a portion of the source regions. A current limiting circuit is coupled between the conductive electrode and the gate electrode and a voltage limiting circuit is coupled between the drain electrode and the gate electrode.

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Mountaintop, PA, United States of America

Frederick P Jones