International Business Machines Corporation

Frederick G Weindelmayer

Raymond R Horton

Michael J Palmer

Bernie Hernandez

Ismail C Noyan

Bernardo Hernandez

Sheila J Konecke

Michael A Sipe

A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row.

Castellated nozzle and method of use thereof

A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row. A channel is formed adjacent to at least one castellation. The first and second plurality of castellations are arranged in a staggered format wherein at a first point along the length of the opening one of the castellations in the first row is located opposite to one of the channels of the second row, and wherein at a second point along the length of the opening one of the channels in the first row is located opposite to one of the castellations in the second row. An opening is formed between the first and second row. The castellated nozzle includes a hole for aligning the castellated nozzle to a flexible circuit carrier.

Castellated nozzle and method of use therof

A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

Solder application system using helix to control solder meniscus

The invention is comprised of a method and apparatus for inspecting substrates and hat sink hat assemblies to determine whether the chips on the substrate and pistons on the heatsink hat assembly are matched. The inspection is carried out by separately illuminating both the substrate and the heatsink hat assembly in such a way that a bilevel image of each assembly is created. Each assembly has an associated image-acquisition device, such as a television or video camera which captures the bilevel image. These images are then converted to an array of image points. The points of the image of the substrate assembly are compared with a preset pattern to determine whether a chip is missing. A similar comparison is done with the points of the image of the heatsink hat assembly to determine whether any piston is missing. A deviation from the expected pattern will be communicated to an operator who will take corrective action.

Method and apparatus for inspection of matched substrate heatsink and

In manufacturing packaged modules for computer systems, many modules require sealing a lid to a lower substrate by using solder around the outer edges of the lower substrate. When the solder is heated, it often flows inward towards the chips on the substrates (solder intrusions) and may cause shorts. This invention solves the problem of solder intrusions by using a graphite lid seal fixture during lid seal. The fixture is comprised of lower and upper parts. The substrate, which has a sealband area, rests on and is held in place by the lower part of the fixture. The upper part of the fixture rests on the lower part. The lid, which has solder on its lower surface which is slightly smaller but otherwise generally matches the sealband area of the substrate, fits in a hole in the upper part and rests on the substrate. Thus, graphite substantially surrounds the edges where the lid and substrate meet and the fixture evenly distributes the heat around the sealband during reflow so that the solder can flow out towards the edge of the sealband. By this means, areas where solder flows back into the interior of the module are reduced and hermeticity yields are improved.

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Manassas, VA, United States of America

Frederick G Weindelmayer