The Boeing Company

Ballard Power Systems Corporation

Frederick D McKenney

Minas Hagop Tanielian

Joerg Zimmermann

Kin Li

Alexander Douglas Mossman

Michael M Ladd

Robert Henry Artibise

Steven D Gabrys

An integrated current collector and electrical component plate for a fuel cell stack is disclosed, comprising a printed circuit board comprising the following layers: a current collection layer, comprising a current collector; a first insulation layer, comprising a first surface and a second surface; an electrical component layer, comprising an electrical component having a first connection site and a second connection site; and a second insulation layer, comprising a first surface and a second surface, wherein the current collection layer is laminated to the first surface of the first insulation layer, and the electrical component layer is laminated between the second surface of the first insulation layer and the first surface of the second insulation layer. A fuel cell stack and methods for manufacturing a fuel cell stack comprising the integrated current collector and electrical component plate are also disclosed.

Integrated current collector and electrical component plate for a fuel cell stack

Semiconductor materials optimized for their electrical conductivity and thermal conductivity promise much higher thermoelectric cooling power. The materials can achieve the same cooling or power generation capacity in thermopiles with less electron current compared with present bulk materials. Because less electron current is required to accomplish the same task, total thermopile semiconductor material cross-sectional area normal to thermal and electron flow is greatly reduced and the element length-to-cross-sectional area aspect ratio is increased. The net result is a significant improvement in the figure of merit, ZT, and in the device Coefficient of Performance (COP).

Method for making advanced thermoelectric devices

Growing community of inventors

Seattle, WA, United States of America

Frederick D McKenney