Stats Chippac Pte. Ltd.

Frederick Cruz Santos

Jae Hak Yee

Chee Keong Chin

Yu Feng Feng

Jun Jie Xu

Yong Yong Xia

An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.

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Shanghai, China

Frederick Cruz Santos