Broadcom Corporation

Frederic Christian Marc Hayem

Claude G Hayek

Ahmadreza Rofougaran

Maryam Rofougaran

Vafa James Rakshani

Nelson Ray Sollenberger

Hooman Darabi

Yossi Cohen

Anatoly Gelman

Ronish Patel

Kiran Puttegowda

Weidong Rick Li

Louis Botha

Hendrik Johannes Conroy

Mike (Hon Fai) Chu

Hon Fai (Mike) Chu

An integrated circuit (IC) includes at least one baseband section, at least one radio frequency (RF) section, and an interface module. The interface module is configured to couple the at least one baseband section to the at least one RF section, wherein the interface module includes an analog interface module and a digital interface module.

IC with mixed mode RF-to-baseband interface

An integrated circuit (IC) includes a first processing module that converts inbound data into an inbound digital audio signal and converts an outbound digital audio signal into outbound data. A second processing module performs a user application that includes at least one of generating of an inbound analog audio signal and generating an outbound analog audio signal. A third processing module performs an operating system algorithm to coordinate operation of at least one user application.

Multi-mode IC with multiple processing cores

A Voice-Data-RF IC includes a baseband processing module, an RF section, and an interface module. The baseband processing module converts an outbound voice signal into an outbound voice symbol stream, converts an inbound voice symbol stream into an inbound voice signal, converts outbound data into an outbound data symbol stream, and converts an inbound data symbol stream into inbound data. The interface module provides selective coupling between the baseband processing module, the RF section, and with off-chip circuits.

Voice/Data/RF integrated circuit

A Voice-Data-RF IC includes a baseband processing module, an RF section, and an interface module. The baseband processing module converts an outbound voice signal into an outbound voice symbol stream, converts an inbound voice symbol stream into an inbound voice signal, converts outbound data into an outbound data symbol stream, and converts an inbound data symbol stream into inbound data. The RF section converts an inbound RF voice signal into the inbound voice symbol stream, converts the outbound voice symbol stream into an outbound RF voice signal, converts an inbound RF data signal into the inbound data symbol stream, and converts the outbound data symbol stream into an outbound RF data signal. The interface module provides coupling between the baseband processing module, the RF section, and with off-chip circuits.

Voice/data/RF integrated circuit

A communication device includes a memory module that stores a plurality of applications corresponding to a plurality of uses of the communication device. A processing module executes a selected one of the plurality of applications and selects one of a plurality of power modes based on a current one of the plurality of uses of the communication device corresponding to the selected one of the plurality of applications. The processing module generates a power mode signal based on the selected one of the plurality of power modes. A power management circuit receives the power mode signal and that generates a plurality of power supply signals based on the power mode signal.

Power management for a mobile communication device and method for use therewith

An integrated circuit (IC) includes at least one baseband section, at least one radio frequency (RF) section, and an interface module. The interface module is operable to couple the at least one baseband section to the at least one RF section, wherein the interface module includes an analog interface module and a digital interface module.

An integrated circuit (IC) includes an RF section, a DSP, and a plurality of processors. The RF section and the DSP process an inbound RF signal to produce inbound data and process outbound data to produce an outbound RF signal. In addition, the DSP converts an outbound analog audio signal into an outbound digital audio signal and converts an inbound digital audio signal into an inbound analog audio signal. A first processor converts the inbound data into the inbound digital audio signal and converts the outbound digital audio signal into the outbound data. A second processor performs a user application that includes at least one of generation of the inbound analog audio signal and generation of the outbound analog audio signal and performs an operating system algorithm to coordinate operation of the user application.

An adjustable antenna interface includes a single-ended to differential conversion circuit, an adjustable impedance matching circuit, an RF differential switch, and an input. The single-ended to differential conversion circuit converts inbound RF signals from single-ended signals to differential signals and converts outbound RF signals from differential signals to single-ended signals. The adjustable impedance matching circuit provides an impedance based on an impedance control signal. The RF differential switch provides the differential outbound RF signals from the IC to the single-ended to differential conversion circuit in accordance with a first antenna control signal and provides the differential inbound RF signals from the single-ended to differential conversion circuit to the IC in accordance with a second antenna control signal. The input receives the first antenna control signal, the second antenna control signal, and the impedance control signal from the IC.

Adjustable antenna interface and applications thereof

A plurality of baseband clock signals by detecting an interference condition associated with at least one of the plurality of baseband clock signals and by spreading the spectrum of the at least one of the plurality of baseband clock signals when the interference condition is detected.

Radio frequency integrated circuit having frequency dependent noise mitigation with spectrum spreading

A communication device includes a voice data and RF integrated circuit (IC) that includes a memory module that stores a plurality of applications corresponding to a plurality of uses of the communication device. A processing module executes a selected one of the plurality of applications and selects one of a plurality of power modes based on a current one of the plurality of uses of the communication device corresponding to the selected one of the plurality of applications. The processing module generates a power mode signal based on the selected one of the plurality of power modes. An off-chip power management circuit receives the power mode signal and that generates a plurality of power supply signals to the voice data and RF IC based on the power mode signal.

A single chip wireless transceiver operable to perform voice, data and radio frequency (RF) processing is provided. This processing may be divided between various processing modules. This single chip includes a processing module having an ARM microprocessor and a digital signal processor (DSP), an RF section, and an interface module. The processing module converts an outbound voice signal into an outbound voice symbol stream, converts an inbound voice symbol stream into an inbound voice signal, converts outbound data into an outbound data symbol stream, and converts an inbound data symbol stream into inbound data. These functions may be divided between the ARM microprocessor and DSP, where the DSP supports physically layer type applications and the ARM microprocessor supports higher layer applications. Further bifurcation may be based on voice applications, data applications, and/or RF control. The RF section converts an inbound RF voice signal into the inbound voice symbol stream, converts the outbound voice symbol stream into an outbound RF voice signal, converts an inbound RF data signal into the inbound data symbol stream, and converts the outbound data symbol stream into an outbound RF data signal. The interface module provides coupling between the processing module, the RF section, and with off-chip circuits.

Single chip wireless transceiver operable to perform voice, data and radio frequency (RF) processing

An integrated circuit (IC) includes a first die, a second die, a packaging substrate, and coupling circuit. The first die includes first circuitry and the second die includes second circuitry. The packaging substrate supports the first and second dies, wherein the first and second dies are stacked with respect to the packaging substrate. The coupling circuit couples the first die to the second die, wherein the first and second circuitry communicate via the coupling circuit.

Multiple die integrated circuit assembly

A real-time/non-real-time/RF IC includes first and second baseband processing modules, an RF section, a wireline interface, and a bus structure. The first baseband processing module converts real-time outbound data into real-time outbound symbols and converts real-time inbound symbols into real-time inbound data. The second baseband processing module converts non-real-time outbound data into non-real-time outbound symbols and converts non-real-time inbound symbols into non-real-time inbound data. The RF section converts the real-time outbound symbols into real-time outbound RF signals, converts real-time inbound RF signals into the real-time inbound symbols, converts the non-real-time outbound symbols into non-real-time outbound RF signals, and converts non-real-time inbound RF signals into the non-real-time symbols. The wireline interface couples the non-real-time outbound data, the non-real-time inbound data, the real-time outbound data, and/or the real-time inbound data to an off-chip wireline connection.

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San Diego, CA, United States of America

Frederic Christian Marc Hayem