Datacard Corporation

Entrust Datacard Corporation

Frederic Beulet

Benoit Berthe

Dominique Perdoux

Ulrich Bielesch

Sebastien Michenet

Patrick Baudron

Thorsten Habel

An object processing machine for processing a plurality of objects, the machine comprising: a plurality of processing modules, each processing module having a modular structure co-operable with the modular structure of another processing module to form a modular assembly constituting the object processing machine; each processing module being operable to perform a corresponding processing operation on an object and being provided with at least one transfer unit located at a respective port of the processing module; each transfer unit being arranged to transfer an object to or from the corresponding processing module and/or to or from a transfer unit of another processing module of the modular assembly; the transfer units being arranged to co-operate with one another and/or with another processing unit such that objects can be guided from an input of the machine to an output of the machine via a plurality of different transport pathways through the machine, wherein the transport pathway taken by a said object being processed corresponds to the pre-determined processing operations to be performed on the said object. A method of processing a plurality of objects using such a machine is also described.

Method of and apparatus for processing an object

A method for interleaving a module including the cutting out of the module on a strip, the gripping of the cut-out module, the conveying of the module right up to a station for affixing and adhesively bonding modules. The module being heated by a heater via heat conduction of an affixing system upon conveying and then affixing of the preheated module by positioning the head of a first guiding member on the upper portion of a second guiding member forming a mask showing the imprint of the module or chip, preformed on the card, by displacement of the affixing system and of positioning the lower portion of the second guiding member on the surface of the card by displacement of the assembly formed by the affixing system and the second guiding member. A device for interleaving a module is also described.

Method and device for interleaving a module or chip

A laser marking machine for objects, namely supports or cards carrying integrated circuits, has a laser chamber having two marking locations for receiving the objects to be marked on at least one face by at least one laser marker having optics for deflecting the laser beam onto one of the marking locations. A transfer device has a transfer path for transporting the objects to be marked or already marked, respectively, to or out of the laser chamber.

High-rate laser marking machine

Growing community of inventors

Meung Sur Loire, France

Frederic Beulet