Applied Materials, Inc.

Lam Research Corporation

Fred Conrad Redeker

Shijian Li

Rajeev Bajaj

John Boyd

John Martin De Larios

Michael Ravkin

Mikhail Korolik

Yezdi N Dordi

Nag B Patibandla

Tetsuya Ishikawa

Daniel Redfield

Mahendra Christopher Orilall

Erik Freer

Stan D Tsai

Katrina Mikhaylichenko

Brian J Brown

Thomas H Osterheld

Gregory E Menk

Mike Ravkin

Carl Woods

Ramin Emami

Manoocher Birang

Jason Garcheung Fung

Yuchun Wang

Kapila P Wijekoon

John M White

John P Parks

Boyi Fu

Ashwin Chockalingam

James Paul Garcia

Kasiraman Krishnan

Steven M Zuniga

Hung Chih Chen

Lizhong Sun

William Thie

Ashavani Kumar

Robert E Davenport

Jui-lung Li

Yaxin Wang

Boguslaw A Swedek

Sasson Roger Somekh

Robert D Tolles

Sen-Hou Ko

Doyle E Bennett

Madhavi R Chandrachood

Romuald Nowak

John M deLarios

Mayu Felicia Yamamura

Robert J Steger

Hou Tee Ng

Sivapackia Ganapathiappan

Jeonghoon Oh

Shou-Sung Chang

Paul D Butterfield

Boris Fishkin

Michael N Sugarman

Brian C Lue

Joel M Cook

Hiroji Hanawa

Aleksander Owczarz

Kevin P Fairbairn

Jay D Pinson, Ii

Alan M Schoepp

Jay Gurusamy

Yan Zhao

David J Hemker

Yongqi Hu

Charles N Dornfest

Wen-Chiang Tu

Gopalakrishna B Prabhu

Andreas Norbert Wiswesser

Sidney P Huey

Jaroslaw Walery Winniczek

Robert A Maraschin

Hassan G Iravani

Zhihong Wang

Tony Kaushal

Jeffrey J Farber

David A Chan

Bret W Adams

Jeffrey Drue David

Dan Maydan

Ashok K Sinha

David Walter Groechel

Farhad K Moghadam

Jianshe Tang

Derek R Witty

Charles C Garretson

Wei Guang Lu

Anwar Husain

Semyon Sherstinsky

Turgut Sahin

Mark A Fodor

Robert T Lum

You Wang

Katrina Mikhaylich

Terrance Y Lee

Kent Rossman

Randolph E Treur

Timothy S Dyer

A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

Roller for location-specific wafer polishing

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

Integrated abrasive polishing pads and manufacturing methods

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

Polishing system with annular platen or polishing pad

Polishing system with support post and annular platen or polishing pad

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Precursor formulations for polishing pads produced by an additive manufacturing process

Polishing pads produced by an additive manufacturing process

The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

Multi-layered nano-fibrous CMP pads

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or 'micro-features' and/or a plurality of grooves or 'macro-features' formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

Thin plastic polishing article for CMP applications

A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.

Polishing system with annular platen or polishing pad for substrate monitoring

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Growing community of inventors

Fremont, CA, United States of America

Fred Conrad Redeker